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IL1117C PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 IL1117C
기능 Low Dropout Positive Voltage Regulator
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IL1117C 데이터시트, 핀배열, 회로
IL1117C-xxLow Dropout Positive Voltage Regulator TECHNICAL DATA
Description
The IL1117C is a series of low dropout voltage
regulators which can provide up to 1A of output cur-
rent. The IL1117C is available in eight fixed voltage, 1.2,
1.25, 1.5, 1.8, 2.5, 2.85, 3.3 and 5.0V. Additionally it is
also available in adjustable version. On chip precision
trimming adjusts the reference/ output voltage to within ±
2%. Current limit is also trimmed to ensure specified
output current and controlled short-circuit current.
The IL1117C series is available in SOT-223, TO-
252, TO-220 packages.
A minimum of 10uF tantalum capacitor is required
at the output to improve the transient response and
Stability.
Features
Dropout Voltage 1.2V(Typ)
Reference/Output Voltage Trimmed to ± 2%
Maximum Input Voltage 15V
Adjustable Output Voltage or Fixed
1.2V, 1.25V, 1.5V, 1.8V, 2.5V, 2.85V, 3.3V, 5V
Line Regulation typically at 0.2% max
Load Regulation typically at 0.4% max
Current Limiting and Thermal Protection
Standard 3-Pin Power Packages
Operating Junction Temperature Range
-40 to +125°C
(for IL1117C-1.2V - 0 to +150°C)
Applications
Post Regulator for switching DC/DC Converter
High Efficiency Linear Regulator
Battery Chargers
PC Add on Card
Motherboard clock supplies
LCD Monitor
Set-top Box
SOT-223
TO-252
IL1117C-xxET
TO-220
IL1117C-xxD0T
1. ADJ/GND
2. Output
3. Input
IL1117C-xxKB
Pin#2 connected
with heat sink
ORDERING INFORMATION
Device
IL1117CxxET
IL1117CxxD0T
IL1117C-xxKB
Package
TO-223
TO-252
TO-220
Packing
Tape & Reel
Tape & Reel
Tube
Absolute Maximum Ratings
Symbol
Description
Max
Units
VIN Input Voltage
15 V
IOUT
DC Output Current
PD/(VIN-VO)
mA
TJ
Operating Junction Temperature Range
(* in case of IL1117C-1.2)
-40 to 125
(* 0 to 150)
°C
ΘJA
Thermal Resistance Junction-to-Ambient (SOT-223)
150 °C/W
ΘJA
Thermal Resistance Junction-to-Ambient (TO-252)
80 °C/W
ΘJA
Thermal Resistance Junction-to-Ambient (TO-220)
60 °C/W
ΘJC
Thermal Resistance Junction-to-Case (SOT-223)
35 °C/W
ΘJC
Thermal Resistance Junction-to-Case (TO-252)
22 °C/W
ΘJC
Thermal Resistance Junction-to-Case (TO-220)
15 °C/W
* Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these or any other conditions beyond those indi-
cated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Feb 03, 2015, Ver. 07




IL1117C pdf, 반도체, 판매, 대치품
Typical Perfomance Characteristics
IL1117C-XX
Feb 03, 2015 Ver. 07

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IL1117C 전자부품, 판매, 대치품
IL1117C-XX
Figure 5. Best Load Regulation Using Adjustable Output Regulator
Thermal Protection
IL1117C has thermal protection which limits junction temperature to 150C. However, device functionality is
only guaranteed to a maximum junction temperature of +125C. The power dissipation and junction tempera-
ture for IL1117C in DPAK package are given by
Note: TJUNCTION must not exceed 125C
Current Limit Protection
IL1117C is protected against overload conditions. Current protection is triggered at typically 1.6A.
Thermal Consideration
The IL1117C series contain thermal limiting circuitry designed to protect itself from over-temperature condi-
tions. Even for normal load conditions, maximum junction temperature ratings must not be exceeded. As
mention in thermal protection section, we need to consider all sources of thermal resistance between junction
and ambient. It includes junction-tocase, case-to-heat-sink interface, and heat sink thermal resistance itself.
Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below
the die. Proper mounting is required to ensure the best possible thermal flow from this area of the package to
the heat sink. The case of all devices in this series is electrically connected to the output. Therefore, if the
case of the device must be electrically isolated, a thermally conductive spacer is recommended.
Feb 03, 2015 Ver. 07

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