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PDF MGSF3454XT1 Data sheet ( Hoja de datos )
| Número de pieza | MGSF3454XT1 | |
| Descripción | Small-Signal MOSFETs Single N-Channel Field Effect Transistors | |
| Fabricantes | ON Semiconductor | |
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MGSF3454XT1
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Low RDS(on) Small-Signal
MOSFETs Single N-Channel
Field Effect Transistors
These miniature surface mount MOSFETs utilize the High Cell
Density, HDTMOS® process. Low RDS(on) assures minimal power
loss and conserves energy, making this device ideal for use in small
power management circuitry. Typical applications are dc−dc
converters, power management in portable and battery−powered
products such as computers, printers, PCMCIA cards, cellular and
cordless telephones.
• Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Miniature TSOP−6 Surface Mount Package Saves Board Space
http://onsemi.com
N−CHANNEL
ENHANCEMENT−MODE
MOSFET
RDS(on) = 50 mW (TYP)
DD S
DDG
CASE 318G−02, Style 1
TSOP 6 PLASTIC
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current − Continuous @ TA = 25°C
Drain Current − Pulsed Drain Current (tp ≤ 10 ms)
VDSS
VGS
ID
IDM
30
± 20
1.75
20
Vdc
Vdc
A
Total Power Dissipation @ TA = 25°C
PD 950 mW
Operating and Storage Temperature Range
TJ, Tstg −55 to 150
°C
Thermal Resistance − Junction−to−Ambient
RqJA
250 °C/W
Maximum Lead Temperature for Soldering Purposes, for 10 seconds
TL 260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Device Marking = 3G
Device
MGSF3454XT1
MGSF3454XT3
ORDERING INFORMATION
Reel Size
Tape Width
7″ 8 mm embossed tape
13″ 8 mm embossed tape
Quantity
3000
10,000
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 1
1
Publication Order Number:
MGSF3454XT1/D
1 page  
MGSF3454XT1
INFORMATION FOR USING THE TSOP−6 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.094
2.4
0.037
0.95
0.074
1.9
0.037
0.95
0.039
1.0
TSOP−6
0.028
0.7
inches
mm
TSOP−6 POWER DISSIPATION
The power dissipation of the TSOP−6 is a function of the
drain pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RqJA, the thermal resistance from
the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data
sheet for the TSOP−6 package, PD can be calculated as
follows:
PD =
TJ(max) − TA
RqJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 500 milliwatts.
PD =
150°C − 25°C
250°C/W
= 500 milliwatts
The 250°C/W for the TSOP−6 package assumes the use
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 500
milliwatts. There are other alternatives to achieving higher
power dissipation from the TSOP−6 package. Another
alternative would be to use a ceramic substrate or an
aluminum core board such as Thermal Clad™. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the
same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
http://onsemi.com
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