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부품번호 | TB100 기능 |
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기능 | NPN power transistor | ||
제조업체 | NXP Semiconductors | ||
로고 | |||
전체 10 페이지수
TB100
NPN power transistor
19 December 2013
Product data sheet
1. General description
High voltage, high speed, planar passivated NPN power switching transistor in a SOT54
(TO92) plastic package intended for use in low power SMPS emitter switching circuits.
2. Features and benefits
• Fast switching
• High base current drive capability
• High voltage capability
• Very low switching and conduction losses
3. Applications
• Emitter-switched low power SMPS circuits
• Self Oscillating Power Supplies
• AC-DC converters
• DC-AC inverters
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
IC
collector current
DC
Ptot total power dissipation Tlead ≤ 25 °C; Fig. 1
Tj junction temperature
VCESM
collector-emitter peak VBE = 0 V
voltage
Static characteristics
hFE
DC current gain
VCE = 5 V; IC = 10 mA; Tlead = 25 °C;
Fig. 5; Fig. 6
VCE = 5 V; IC = 100 mA; Tlead = 25 °C;
Fig. 5; Fig. 6
VCE = 5 V; IC = 0.75 A; Tlead = 25 °C;
Fig. 5; Fig. 6
Min Typ Max Unit
- - 1A
- - 2W
- - 150 °C
- - 700 V
12 22 32
14 24 34
12 15.5 20
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NXP Semiconductors
TB100
NPN power transistor
9. Thermal characteristics
Table 6.
Symbol
Rth(j-lead)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to lead
thermal resistance
from junction to
ambient
Conditions
printed circuit board mounted; lead
length = 4 mm; Fig. 2
102
Zth(j-lead)
(K/W)
10
Min Typ Max Unit
- - 60 K/W
- 150 - K/W
aaa-010123
1
10-1
P
d
=
tp
T
10-2
10-5
10-4
10-3
10-2
10-1
tp
T
t
1 10
tp (s)
Fig. 2. Transient thermal impedance from junction to lead as a function of pulse width
TB100
Product data sheet
All information provided in this document is subject to legal disclaimers.
19 December 2013
© NXP N.V. 2013. All rights reserved
4 / 10
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11. Package outline
Plastic single-ended leaded (through hole) package; 3 leads
TB100
NPN power transistor
SOT54
c
E
d
1
2
D
3
b1
AL
L1
b
e1
e
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A b b1 c D d
mm
5.2
5.0
0.48 0.66 0.45
0.40 0.55 0.38
4.8
4.4
1.7
1.4
E
e
e1
L
L1(1)
max.
4.2
3.6
2.54 1.27
14.5
12.7
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
SOT54
TO-92
SC-43A
ISSUE DATE
04-06-28
04-11-16
Fig. 9.
TB100
Package outline TO-92 (SOT54)
All information provided in this document is subject to legal disclaimers.
Product data sheet
19 December 2013
© NXP N.V. 2013. All rights reserved
7 / 10
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