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7SB3257 데이터시트 PDF




ON Semiconductor에서 제조한 전자 부품 7SB3257은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


PDF 형식의 7SB3257 자료 제공

부품번호 7SB3257 기능
기능 Mux / Demux Bus Switch
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7SB3257 데이터시트, 핀배열, 회로
7SB3257
Mux / Demux Bus Switch
The 7SB3257 Mux / Demux Bus Switch is an advanced high−speed
line switch in ultra−small footprint.
Features
High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V
3 W Switch Connection Between 2 Ports
Power Down Protection Provided on Inputs
Ultra−Small Packages
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
B1 A
B0
S
Figure 1. Logic Diagram
B1 1
6S
GND 2
B0 3
5 VCC
4A
Figure 2. TSOP−6/SC−88
(Top View)
B1 1
GND 2
B0 3
6S
5 VCC
4A
Figure 3. ULLGA6/UDFN6
(Top View)
Function Table
Input S
L
H
Function
A = B0
A = B1
© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 4
1
http://onsemi.com
6
1
SOT−363/SC70−6/SC−88
DF SUFFIX
CASE 419B
MARKING
DIAGRAMS
6
AK MG
G
1
6
6
TSOP−6
DT SUFFIX
AG MG
1 CASE 318G
G
1
ULLGA6
M
1.0 x 1.0
CASE 613AD
G
1
ULLGA6
M
1.2 x 1.0
G
CASE 613AE
1
ULLGA6
1.45 x 1.0
CASE 613AF
M
G
1
UDFN6
1.0 x 1.0
XM
CASE 517BX
1
UDFN6
1.2 x 1.0
CASE 517AA
M
G
1
UDFN6
1.45 x 1.0
CASE 517AQ
XM
1
AK, AG, K, D, L = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Publication Order Number:
7SB3257/D




7SB3257 pdf, 반도체, 판매, 대치품
AC Loading and Waveforms
From Output
Under Test
CL = 50 pF
(see Note A)
500 W S1
500 W
7V
Open
GND
7SB3257
TEST
tPD
tPLZ/tPZL
tPHZ/tPZH
S1
Open
7V
GND
LOAD CIRCUIT
Input
1.5 V
1.5 V
3V
0V
tPHL
tPLH
Output
VOH
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
Output
Control
1.5 V
1.5 V
3V
0V
Output
Waveform 1
S1 at 7 V
(see Note B)
tPZL
1.5 V
tPLZ
3.5 V
VOL + 0.3 V
VOL
Output
Waveform 2
S1 at Open
(see Note B)
tPZH
1.5 V
tPHZ
VOH − 0.3 V VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 W, tr 2.5 ns, tf 2.5 ns.
D. The output is measured with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 4. Load Circuit and Voltage Waveforms
DEVICE ORDERING INFORMATION
Device
Package
Shipping
7SB3257DTT1G
NLV7SB3257DTT1G*
7SB3257DTT2G
TSOP−6
(Pb−Free)
3000 / Tape & Reel
7SB3257DFT2G
SC−88
(Pb−Free)
3000 / Tape & Reel
7SB3257AMX1TCG
ULLGA6 − 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
7SB3257BMX1TCG
ULLGA6 − 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
7SB3257CMX1TCG
ULLGA6 − 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
7SB3257MU1TCG
UDFN6 − 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
7SB3257MUTCG
UDFN6 − 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
7SB3257MU3TCG
UDFN6 − 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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7SB3257 전자부품, 판매, 대치품
7SB3257
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
D AB
PIN ONE
REFERENCE
ÉÉÉÉÉÉÉÉÉ2X 0.10 C
2X 0.10 C TOP VIEW
E
0.05 C
A3
A
0.05 C
A1
SIDE VIEW
C
SEATING
PLANE
e
1
L1
5X L
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.12 0.22
D 1.00 BSC
E 1.00 BSC
e 0.35 BSC
L 0.25 0.35
L1 0.30 0.40
RECOMMENDED
SOLDERING FOOTPRINT*
5X
0.48
6X
0.22
1.18
64
BOTTOM VIEW
6X b
0.10 M
0.05 M
CAB
C NOTE 3
1
0.53
PKG
OUTLINE
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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부품번호상세설명 및 기능제조사
7SB3257

Mux / Demux Bus Switch

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