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PDF AR0134 Data sheet ( Hoja de datos )
| Número de pieza | AR0134 | |
| Descripción | 1/3-Inch 1.2 Mp CMOS Digital Image Sensor | |
| Fabricantes | ON Semiconductor | |
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AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Features
1/3-Inch 1.2 Mp CMOS Digital Image Sensor with
Global Shutter
AR0134 Datasheet, Rev. G
For the latest datasheet revision, please visit www.onsemi.com
Features
• ON Semiconductor's 3rd Generation Global Shutter
Technology
• Superior low-light performance
• HD video (720p60)
• Video/Single Frame mode
• Flexible row-skip modes
• On-chip AE and statistics engine
• Parallel and serial output
• Support for external LED or flash
• Auto black level calibration
• Context switching
Applications
• Scene processing
• Scanning and machine vision
• 720p60 video applications
General Description
ON Semiconductor's AR0134 is a 1/3-inch 1.2 Mp
CMOS digital image sensor with an active-pixel array
of 1280H x 960V. It is designed for low light perfor-
mance and features a global shutter for accurate cap-
ture of moving scenes. It includes sophisticated
camera functions such as auto exposure control, win-
dowing, scaling, row skip mode, and both video and
single frame modes. It is programmable through a sim-
ple two-wire serial interface. The AR0134 produces
extraordinarily clear, sharp digital pictures, and its
ability to capture both continuous video and single
frames makes it the perfect choice for a wide range of
applications, including scanning and industrial
inspection.
Table 1:
Key Parameters
Parameter
Typical Value
Optical format
1/3-inch (6 mm)
Active pixels
1280H x 960V = 1.2 Mp
Pixel size
3.75 m
Color filter array
RGB Bayer or Monochrome
Shutter type
Global shutter
Input clock range
6 – 50 MHz
Output pixel clock (maximum) 74.25 MHz
Output
Serial
Parallel
HiSPi
12-bit
Frame rate
Full resolution 54 fps
720p
60 fps
Responsivity
Monochrome 6.1 V/lux-sec
Color
5.3 V/lux-sec
SNRMAX
Dynamic range
38.6 dB
64 dB
I/O 1.8 or 2.8 V
Supply
voltage
Digital
Analog
1.8 V
2.8 V
HiSPi
0.4 V
Power consumption
<400 mW
Operating temperature
–30°C to +70°C (ambient)
–30°C to +80°C ( junction)
9 x 9 mm 64-pin iBGA
Package options
10 x 10 mm 48-pin iLCC
Bare die
AR0134_DS Rev. G Pub. 6/15 EN
1 ©Semiconductor Components Industries, LLC 2015,
1 page  
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
List of Tables
List of Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Table 16:
Table 17:
Table 18:
Table 19:
Table 20:
Key Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Available Part Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin Descriptions - 63-Ball iBGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Pin Descriptions - 48 iLCC Package, Parallel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Two-Wire Serial Bus Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
I/O Timing Characteristics, Parallel Output (1.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
I/O Timing Characteristics, Parallel Output (2.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
I/O Rise Slew Rate (2.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
I/O Fall Slew Rate (2.8V VDD_IO)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
I/O Rise Slew Rate (1.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
I/O Fall Slew Rate (1.8V VDD_IO)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Operating Current Consumption for Parallel Output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Standby Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Input Voltage and Current (HiSPi Power Supply 0.4 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Rise and Fall Times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Power-Up Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Power-Down Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Chief Ray Angle - 25deg Mono . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
AR0134_DS Rev. G Pub. 6/15 EN
5 ©Semiconductor Components Industries, LLC,2015.
5 Page 
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Configuration and Pinout
Figure 5: Typical Configuration: Parallel Pixel Data Interface
Digital Digital
I/O core
power1 power1
PLL Analog Analog
power1 power1 power1
VDD_IO VDD
VDD_PLL VAA VAA_PIX
Master clock
(6–50 MHz)
From
Controller
EXTCLK
SDATA
SCLK
TRIGGER
OE_BAR
STANDBY
RESET_BAR
TEST
DGND
VDD_IO
VDD VDD_PLL VAA VAA_PIX
Digital
ground
DOUT [11:0]
PIXCLK
LINE_VALID
FRAME_VALID
FLASH
AGND
To
controller
Analog
ground
Notes:
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but it may be greater for slower two-wire
speed.
3. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
4. The serial interface output pads can be left unconnected if the parallel output interface is used.
5. ON Semiconductor recommends that 0.1μF and 10μF decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on lay-
out and design considerations. Refer to the AR0134 demo headboard schematics for circuit recom-
mendations.
6. ON Semiconductor recommends that analog power planes be placed in a manner such that cou-
pling with the digital power planes is minimized.
AR0134_DS Rev. G Pub. 6/15 EN
11
©Semiconductor Components Industries, LLC,2015.
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet AR0134.PDF ] | |
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