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CS5210-1 데이터시트 PDF




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부품번호 CS5210-1 기능
기능 10A LDO 3-Pin Adjustable Linear Regulator
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CS5210-1 데이터시트, 핀배열, 회로
CS5210−1
10 A LDO 3−Pin Adjustable
Linear Regulator
The CS52101 linear regulator provides 10 A at adjustable voltages
from 1.25 V to 4.5 V. This adjustable device requires two external
resistors to set the output voltage and provide the minimum load
current for proper regulation.
This regulator is intended for use as a post regulator and
microprocessor supply. The fast loop response and low dropout
voltage make this regulator ideal for applications where low voltage
operation and good transient response are important.
The circuit is designed to operate with dropout voltages as low as
1.05 V at 10 A.
The regulator is protected against overload conditions with
overcurrent and thermal shutdown protection circuitry.
The regulator is available in a TO220 package.
Features
1.25 V to 4.5 V VOUT at 10 A
Dropout Voltage < 1.05 V @ 10 A
2.0% Trimmed Reference
Fast Transient Response
Thermal Shutdown
Current Limit
Short Circuit Protection
5.0 V
VIN VOUT
CS52101
Adj
100 μF
0.1 μF
3.3 V @ 10 A
124
Load
200
300 μF
Figure 1. Applications Diagram
http://onsemi.com
TO220
THREE LEAD
T SUFFIX
CASE 221A
12 3
PIN CONNECTIONS AND
MARKING DIAGRAMS
CS52101
AWLYWW
Tab = VOUT
Pin 1. Ad-
just
2. VOUT
3. VIN
1
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
ORDERING INFORMATION
Device
Package
Shipping
CS52101GT3
TO220* 50 Units/Rail
*TO220 is 3pin, straight leaded.
© Semiconductor Components Industries, LLC, 2006
July, 2006 Rev. 7
1
Publication Order Number:
CS52101/D




CS5210-1 pdf, 반도체, 판매, 대치품
CS52101
0.100
0.075
0.050
IO = 10 mA
VIN = 2.75 V
0.025
0.000
0.025
0.050
0.075
0.100
0.125
0.150
0 10 20 30 40 50 60 70 80 90 100 110 120 130
TJ (°C)
Figure 5. Reference Voltage vs.
Temperature
0.350
0.300
0.250
TCASE = 125°C
0.200
0.150
TCASE = 25°C
0.100
0.050
TCASE = 0°C
0.000
01 23 45 6 7 8 9
Output Current (A)
Figure 6. Load Regulation vs. Output
Current
10
90
80
70
60
50
40
VIN VOUT = 2.0 V
IOUT = 4.0 A
30 VRIPPLE = 1.0 VPP
COUT = 22 μF
20 CAdj = 0.1 μF
10101
102 103 104 105
Frequency (Hz)
106
Figure 7. Ripple Rejection vs. Frequency
1.250
1.000
0.750
0.500
0.250
0.000
0
12345678
Output Current (A)
Figure 8. VDROPOUT vs. IOUT
9 10
20
18
16
14
12
10
8
6
4
2
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VIN VOUT (V)
Figure 9. Short Circuit vs. VIN VOUT
1.00
0.98
0.96
0.94
0.92
0.90
0.88
0.86
0.84
0.82
0.80
1
TCASE = 25°C
TCASE = 125°C
TCASE = 0°C
234
VIN VOUT (V)
Figure 10. Minimum Load Current vs.
VIN VOUT
5
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CS5210-1 전자부품, 판매, 대치품
CS52101
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type. The
maximum power dissipation for a regulator is:
PD(max) + (VIN(max) * VOUT(min))IOUT(max) ) VIN(max) IIN(max)
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air. Each material in the heat flow path
between the IC and the outside environment has a thermal
resistance. Like series electrical resistances, these
resistances are summed to determine the total thermal
resistance between the die junction and the surrounding air,
RΘJC. This total thermal resistance is comprised of three
components. These resistive terms are measured from
junction to case (RΘJC), case to heat sink (RΘCS), and heat
sink to ambient air (RΘSA). The equation is:
RQJA + RQJC ) RQCS ) RQSA
RΘJC is rated @ 1.4°C/W for the CS52101. For a high
current regulator such as the CS52101 the majority of heat
is generated in the power transistor section. The value for
RΘSA depends on the heat sink type, while the RΘCS depends
on factors such as package type, heat sink interface (is an
insulator and thermal grease used?), and the contact area
between the heat sink and the package. Once these
calculations are complete, the maximum permissible value
of RΘJA can be calculated and the proper heat sink selected.
For further discussion on heat sink selection, see application
note “Thermal Management,” document number
AND8036/D, available through the Literature Distribution
Center or via our website at http://onsemi.com.
http://onsemi.com
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