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PDF TLE9263-3QX Data sheet ( Hoja de datos )

Número de pieza TLE9263-3QX
Descripción System Basis Chip
Fabricantes Infineon　
Logotipo Infineon Logotipo



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System Basis Chip
TLE9263-3QX
Mid-Range System Basis Chip Family
Body System IC with Integrated Voltage Regulators, Power Management Functions,
HS-CAN Transceiver supporting CAN FD featuring Partial Networking (incl. FD
Tolerant Mode) and Multiple LIN Transceiver.
Featuring Multiple High-Side Switches and High-Voltage Wake Inputs.
Data Sheet
Rev. 1.1, 2014-09-26
Automotive Power

1 page




TLE9263-3QX pdf
TLE9263-3QX
Table of Contents
15.7
15.8
15.9
15.9.1
15.9.2
15.9.3
15.10
16
16.1
16.2
16.3
16.4
16.5
16.5.1
16.5.2
16.5.3
16.6
16.6.1
16.6.2
16.6.3
16.7
17
17.1
17.2
17.3
18
19
VCC1 Short Circuit and VCC3 Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
VCC2 Undervoltage and VCAN Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Thermal Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Individual Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Temperature Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
SBC Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
SPI Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Failure Signalization in the SPI Data Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
SPI Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
SPI Bit Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
SPI Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
General Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
Selective Wake Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
Selective Wake Trimming and Calibration Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
SPI Status Information Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
General Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
Selective Wake Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183
Family and Product Information Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
Thermal Behavior of Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
Data Sheet
5 Rev. 1.1, 2014-09-26

5 Page





TLE9263-3QX arduino
TLE9263-3QX
Pin Configuration
Pin Symbol
Function
31 INT
Interrupt Output; used as wake-up flag for microcontroller in SBC Stop or Normal
Mode and for indicating failures. Active low.
During start-up used to set the SBC configuration. External pull-up sets config 1/3,
no external pull-up sets config 2/4.
32 RO
Reset Output
33 TXDLIN1
Transmit LIN1
34 RXDLIN1
Receive LIN1
35 TXDCAN
Transmit CAN; alternate function: calibration of high-precision oscillator
36 RXDCAN
Receive CAN
37 VCAN
Supply Input; for internal HS-CAN cell
38 GND
GND
39 CANL
CAN Low Bus Pin
40 CANH
CAN High Bus Pin
41 n.c.
not connected; internally not bonded.
42 LIN1
LIN1 Bus; Bus line for the LIN interface, according to ISO. 9141 and LIN
specification 2.2 as well as SAE J2602-2.
43 GND
Ground
44 LIN2
LIN2 Bus; Bus line for the LIN interface, according to ISO. 9141 and LIN
specification 2.2 as well as SAE J2602-2.
45 n.c.
not connected; internally not bonded.
46 n.c.
not connected; internally not bonded.
47 FO2
Fail Output 2 - Side Indicator; Side indicators 1.25Hz 50% duty cycle output;
Open drain. Active LOW.
Alternative Function: GPIO1; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO2, see also Chapter 14.1.1)
48 FO3/TEST
Fail Output 3 - Pulsed Light Output; Break/rear light 100Hz 20% duty cycle output;
Open drain. Active LOW
TEST; Connect to GND to activate SBC Software Development Mode;
Integrated pull-up resistor. Connect to VS with pull-up resistor or leave open for
normal operation.
Alternative Function: GPIO2; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO3, see also Chapter 14.1.1)
Cooling GND
Tab
Cooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an
electrical ground.1)
1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB. The
exposed die pad is not connected to any active part of the IC an can be left floating or it can be connected to GND
(recommended) for the best EMC performance.
Note: all VS Pins must be connected to battery potential or insert a reverse polarity diodes where required;
all GND pins as well as the Cooling Tab must be connected to one common GND potential;
Data Sheet
11 Rev. 1.1, 2014-09-26

11 Page







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