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PDF TLE9262-3QXV33 Data sheet ( Hoja de datos )
| Número de pieza | TLE9262-3QXV33 | |
| Descripción | System Basis Chip | |
| Fabricantes | Infineon | |
| Logotipo |  |
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System Basis Chip
TLE9262-3QXV33
Mid-Range System Basis Chip Family
Body System IC with Integrated Voltage Regulators, Power Management Functions,
HS-CAN Transceiver supporting CAN FD featuring Partial Networking (incl. FD
Tolerant Mode) .
Featuring Multiple High-Side Switches and High-Voltage Wake Inputs.
Data Sheet
Rev. 1.1, 2014-10-23
Automotive Power
1 page  
TLE9262-3QXV33
Table of Contents
15.7
15.8
15.9
15.9.1
15.9.2
15.9.3
15.10
16
16.1
16.2
16.3
16.4
16.5
16.5.1
16.5.2
16.5.3
16.6
16.6.1
16.6.2
16.6.3
16.7
17
17.1
17.2
17.3
18
19
VCC1 Short Circuit Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
VCC2 Undervoltage and VCAN Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Thermal Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Individual Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Temperature Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
SBC Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
SPI Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Failure Signalization in the SPI Data Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
SPI Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
SPI Bit Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
SPI Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
General Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Selective Wake Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
Selective Wake Trimming and Calibration Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
SPI Status Information Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
General Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
Selective Wake Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
Family and Product Information Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
Thermal Behavior of Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
Data Sheet
5 Rev. 1.1, 2014-10-23
5 Page 
TLE9262-3QXV33
Pin Configuration
Pin Symbol
Function
31 INT
Interrupt Output; used as wake-up flag for microcontroller in SBC Stop or Normal
Mode and for indicating failures. Active low.
During start-up used to set the SBC configuration. External pull-up sets config 1/3,
no external pull-up sets config 2/4.
32 RO
Reset Output
33 TXDLIN1
Transmit LIN1
34 RXDLIN1
Receive LIN1
35 TXDCAN
Transmit CAN; alternate function: calibration of high-precision oscillator
36 RXDCAN
Receive CAN
37 VCAN
Supply Input; for internal HS-CAN cell
38 GND
GND
39 CANL
CAN Low Bus Pin
40 CANH
CAN High Bus Pin
41 n.c.
not connected; internally not bonded.
42 LIN1
LIN1 Bus; Bus line for the LIN interface, according to ISO. 9141 and LIN
specification 2.2 as well as SAE J2602-2.
43 GND
Ground
44 N.U.
Not Used; Used for internal testing purpose. Do not connect, leave open
45 n.c.
not connected; internally not bonded.
46 n.c.
not connected; internally not bonded.
47 FO2
Fail Output 2 - Side Indicator; Side indicators 1.25Hz 50% duty cycle output;
Open drain. Active LOW.
Alternative Function: GPIO1; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO2, see also Chapter 14.1.1)
48 FO3/TEST
Fail Output 3 - Pulsed Light Output; Break/rear light 100Hz 20% duty cycle output;
Open drain. Active LOW
TEST; Connect to GND to activate SBC Software Development Mode;
Integrated pull-up resistor. Connect to VS with pull-up resistor or leave open for
normal operation.
Alternative Function: GPIO2; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO3, see also Chapter 14.1.1)
Cooling GND
Tab
Cooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an
electrical ground.1)
1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB. The
exposed die pad is not connected to any active part of the IC an can be left floating or it can be connected to GND
(recommended) for the best EMC performance.
Note: all VS Pins must be connected to battery potential or insert a reverse polarity diodes where required;
all GND pins as well as the Cooling Tab must be connected to one common GND potential;
Data Sheet
11 Rev. 1.1, 2014-10-23
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet TLE9262-3QXV33.PDF ] | |
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