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PDF TLE9261-3QX Data sheet ( Hoja de datos )
| Número de pieza | TLE9261-3QX | |
| Descripción | System Basis Chip | |
| Fabricantes | Infineon | |
| Logotipo |  |
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System Basis Chip
TLE9261-3QX
Mid-Range System Basis Chip Family
Body System IC with Integrated Voltage Regulators, Power Management Functions,
HS-CAN Transceiver supporting CAN FD featuring Partial Networking (incl. FD
Tolerant Mode) .
Featuring Multiple High-Side Switches and High-Voltage Wake Inputs.
Data Sheet
Rev. 1.1, 2014-09-26
Automotive Power
1 page  
TLE9261-3QX
Table of Contents
15.5.2
15.5.3
15.6
15.6.1
15.6.2
15.6.3
15.7
16
16.1
16.2
16.3
17
18
Selective Wake Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
Selective Wake Trimming and Calibration Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
SPI Status Information Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
General Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
Selective Wake Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
Family and Product Information Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
Thermal Behavior of Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
Data Sheet
5 Rev. 1.1, 2014-09-26
5 Page 
TLE9261-3QX
Pin Configuration
Pin Symbol
Function
31 INT
Interrupt Output; used as wake-up flag for microcontroller in SBC Stop or Normal
Mode and for indicating failures. Active low.
During start-up used to set the SBC configuration. External pull-up sets config 1/3,
no external pull-up sets config 2/4.
32 RO
Reset Output
33 N.U.
Not Used; Used for internal testing purpose. Do not connect, leave open
34 N.U.
Not Used; Used for internal testing purpose. Do not connect, leave open
35 TXDCAN
Transmit CAN; alternate function: calibration of high-precision oscillator
36 RXDCAN
Receive CAN
37 VCAN
Supply Input; for internal HS-CAN cell
38 GND
GND
39 CANL
CAN Low Bus Pin
40 CANH
CAN High Bus Pin
41 n.c.
not connected; internally not bonded.
42 N.U.
Not Used; Used for internal testing purpose. Do not connect, leave open
43 GND
Ground
44 N.U.
Not Used; Used for internal testing purpose. Do not connect, leave open
45 n.c.
not connected; internally not bonded.
46 n.c.
not connected; internally not bonded.
47 FO2
Fail Output 2 - Side Indicator; Side indicators 1.25Hz 50% duty cycle output;
Open drain. Active LOW.
Alternative Function: GPIO1; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO2, see also Chapter 13.1.1)
48 FO3/TEST
Fail Output 3 - Pulsed Light Output; Break/rear light 100Hz 20% duty cycle output;
Open drain. Active LOW
TEST; Connect to GND to activate SBC Software Development Mode;
Integrated pull-up resistor. Connect to VS with pull-up resistor or leave open for
normal operation.
Alternative Function: GPIO2; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO3, see also Chapter 13.1.1)
Cooling GND
Tab
Cooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an
electrical ground.1)
1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB. The
exposed die pad is not connected to any active part of the IC an can be left floating or it can be connected to GND
(recommended) for the best EMC performance.
Note: all VS Pins must be connected to battery potential or insert a reverse polarity diodes where required;
all GND pins as well as the Cooling Tab must be connected to one common GND potential;
Data Sheet
11 Rev. 1.1, 2014-09-26
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet TLE9261-3QX.PDF ] | |
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