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AS3649 데이터시트 PDF




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부품번호 AS3649 기능
기능 2500mA High Current LED Flash Driver
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AS3649 데이터시트, 핀배열, 회로
AS3649
2500mA High Current LED Flash Driver
1 General Description
The AS3649 is an inductive high efficient DCDC step up converter
with two current sources. The DCDC step up converter operates at a
fixed frequency of 4MHz and includes soft startup to allow easy
integration into noise sensitive RF systems. The two current sources
can operate in flash / torch or video light modes.
The AS3649 includes flash timeout, overvoltage, overtemperature,
undervoltage and LED short/open circuit protection functions. A
TXMASK/TORCH function reduces the flash current in case of
parallel operation to the RF power amplifier and avoids a system
shutdown. Alternatively this pin can be used to directly operate the
torch light directly. If the TXMask function is not used, it can be used
as a hardware torch input (programmable).
A hardware NTC pin can be used to measure the LED temperature
with the ADC and to automatically reduce the LED current if a
temperature threshold is exceeded.
The AS3649 is controlled by an I2C interface and has a hardware
reset pin ON. Setting ON=0 resets the AS3649. Interface input
voltage levels are 1.8V compliant.
The AS3649 is available in a space-saving WL-CSP package
measuring only 2.06x2.02x0.6mm and operates over the -30ºC to
+85ºC temperature range.
Figure 1. Typical Operating Circuit
2 Key Features
High efficiency 4MHz fixed frequency DCDC Boost converter
with soft start allows small coils
- Stable even in coil current limit
LED current adjustable up to 2x1000mA(2x1250mA with current
boost) or 2000mA and automatic load balancing for two LEDs
Automatic current adjustment for low battery voltage
PWM operation for lower output current for reliable light output
of the LED; can run at 31.5kHz to avoid audible noise
Protection functions:
Automatic Flash Timeout timer to protect the LED(s)
Overvoltage and undervoltage Protection
Overtemperature Protection
LED short/open circuit protection
ADC to measure LED temperature
NTC to automatically reduce the flash current if the LED
temperature is too high (programmable level)
I2C Interface with hardware reset pin
Available in tiny WL-CSP Package, 16 balls 0.5mm pitch,
2.06x2.02x0.6mm package size
3 Applications
Flash/Torch for mobile phones

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www.ams.com/AS3649
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AS3649 pdf, 반도체, 판매, 대치품
AS3649
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 5 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min Max Units
Comments
VIN to GND
-0.3 +7.0
V
STROBE, TXMASK/TORCH, SCL, SDA, ON, NTC to
GND
-0.3 VIN + 0.3
V
max. +7V
SW1/2, VOUT1/2, LED_OUT1/2 to GND
VOUT1/2 to SW1/2
-0.3 +7.0
-0.3
V
V Note: Diode between VOUT1/2 and SW1/2
voltage between AGND, PGND1/2 pins
0.0 0.0
V
short connection required
Input Pin Current without causing latchup
-100
+100
+IIN
mA
Continuous Power Dissipation (TA = +70ºC)
Norm: EIA/JESD78
Continuous power dissipation
Continuous power dissipation derating factor
Electrostatic Discharge
1470 mW
20 mW/ºC
PT at 70ºC1
PDERATE2
ESD HBM
±2000
V
Norm: JEDEC JESD22-A114F
ESD CDM
±500 V
Norm: JEDEC JESD 22-C101E
Temperature Ranges and Storage Conditions
Junction to ambient thermal resistance
503
ºC/W
For more information about thermal metrics, see
application note AN01 Thermal Characteristics
Junction Temperature
+150
ºC
Internally limited (overtemperature protection),
max. 20000s
Storage Temperature Range
-55 +125
ºC
Humidity
5 85 %
Non condensing
Body Temperature during Soldering
+260 ºC
according to IPC/JEDEC J-STD-020
Moisture Sensitivity Level (MSL)
MSL 1
Represents a max. floor life time of unlimited
1. Depending on actual PCB layout and PCB used measured on demoboard; for peak power dissipation during flashing see document
'AS3649 Thermal Measurements'
2. PDERATE derating factor changes the total continuous power dissipation (PT) if the ambient temperature is not 70ºC. Therefore for e.g.
TAMB=85ºC calculate PT at 85ºC = PT - PDERATE * (85ºC - 70ºC)
3. Measured on AS3649 demoboard.
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AS3649 전자부품, 판매, 대치품
AS3649
Datasheet - Electrical Characteristics
Table 3. Electrical Characteristics (Continued)
Symbol
Parameter
Digital Interface
Condition
VIH High Level Input Voltage
VIL Low Level Input Voltage
Pins ON, SCL, SDA.
and TXMASK/TORCH
VIHFLASH
VILFLASH
High Level Input Voltage
Low Level Input Voltage
Pin STROBE.
VOL Low Level Output Voltage
Pin SDA, IOL=3mA
ILEAK
Leakage current
Pins ON, SCL, SDA
IPD Pulldown current to GND5
Pins STROBE and TXMASK/TORCH
tDEBTORCH TORCH debounce time
tDEBTXMASK TXMASK debounce timer
I2C mode timings - see Figure 3 on page 8
fSCLK
SCL Clock Frequency
Bus Free Time Between a
tBUF STOP and START
Condition
tHD:STA
tLOW
tHIGH
tSU:STA
Hold Time (Repeated)
START Condition6
LOW Period of SCL Clock
HIGH Period of SCL Clock
Setup Time for a Repeated
START Condition
tHD:DAT
Data Hold Time7
tSU:DAT
Data Setup Time8
tR
Rise Time of Both SDA and
SCL Signals
tF
Fall Time of Both SDA and
SCL Signals
tSU:STO
Setup Time for STOP
Condition
CB
Capacitive Load for Each
Bus Line
CB — total capacitance of one bus line in pF
CI/O
I/O Capacitance (SDA,
SCL)
Min Typ Max Unit
1.26
VVIN
V
0.0 0.54 V
0.84
VVIN
V
0.0 0.54 V
0.3 V
-1.0 0.0 +1.0 µA
36 µA
6.3 9 11.7 ms
1.5 µs
0 400 kHz
1.3 µs
0.6
1.3
0.6
0.6
0
100
20 +
0.1CB
20 +
0.1CB
0.6
µs
µs
µs
µs
0.9 µs
ns
300 ns
300 ns
µs
400 pF
10 pF
1. To improve efficiency at low output currents, the active part of the internal switching transistor PMOS is reduced in size to 1/5 its original
size. This reduces the current required to drive the PMOS transistor and therefore improves overall efficiency at low output currents.
2. The maximum current driving capability depends on supply voltage VVIN, LED forward voltage and coil peak current limit.
3. Due to slope compensation of the current limit, ILIMIT changes with duty cycle - see Figure 16 on page 11.
4. Accuracy defined in % of current setting and in absolute value (µA), accuracy values have to be added together
5. A pulldown current of 36µA is equal to a pulldown resistor of 42kat 1.5V
6. After this period, the first clock pulse is generated
7. A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the VIHMIN of the SCL signal) to bridge the
undefined region of the falling edge of SCL.
8. A fast-mode device can be used in a standard-mode system, but the requirement tSU:DAT = to 250ns must then be met. This is
automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of
the SCL signal, it must output the next data bit to the SDA line tR max + tSU:DAT = 1000 + 250 = 1250ns before the SCL line is released.
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