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PDF ADP2230 Data sheet ( Hoja de datos )
| Número de pieza | ADP2230 | |
| Descripción | Low Quiescent Current Buck Regulator | |
| Fabricantes | Analog Devices | |
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Data Sheet
Dual 2 MHz, 800 mA, Synchronous, Low
Quiescent Current Buck Regulator
ADP2230
FEATURES
Input voltage range: 2.3 V to 6.5 V
Fixed and adjustable output voltage options
Fixed output voltage pair options: 1.2 V/1.8 V, 1.2 V/3.3 V,
1.8 V/3.3 V
Adjustable output voltage range: 0.8 V to 6 V
Minimum guaranteed continuous output current: 800 mA
Up to 94% efficiency
Low quiescent current of 15 µA for both channels in power
saving mode (PSM)
Low shutdown current: 0.1 μA (typical)
100% duty cycle for low dropout operation
SYNC pin switching frequency options
2 MHz fixed pulse-width modulation (PWM) mode
2 MHz PSM/PWM automatic transitioning mode
External clock synchronization from 1.5 MHz to 2.5 MHz
Enable input with precision thresholds for each output
180° phase shifted PWM outputs for minimum VIN ripple
Current-limit and thermal shutdown (TSD) protection
Quick output discharge (QOD)
10-lead, 3 mm × 3 mm × 0.75 mm LFCSP package
APPLICATIONS
Portable and battery-powered equipment
Automatic meter readers (WSN)
Point of sales and transaction processing instruments
Mobile phones
Digital cameras and audio devices
Medical instruments
Medium format display tablets and pads
GENERAL DESCRIPTION
The ADP2230 includes two high efficiency, low quiescent current,
800 mA, step-down, dc-to-dc converters in a small, 10-lead,
3 mm × 3 mm, LFCSP package. The total solution requires only
five tiny external components. When the ADP2230 is used with
three 0603 capacitors and two 2 mm × 2 mm inductors, the
total solution size is about 48 mm2, resulting in the smallest
footprint solution to meet a variety of portable applications.
The ADP2230 buck regulator uses a proprietary, high speed,
current mode, constant frequency, PWM control scheme for
excellent stability and transient response. The buck outputs
operate out of phase to reduce the input current ripple.
To ensure the longest battery life in portable applications, the
ADP2230 has a power saving variable frequency mode that
reduces the switching frequency under light load conditions.
Rev. A
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibilityisassumedbyAnalogDevices for itsuse,nor foranyinfringementsofpatentsor other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
TYPICAL APPLICATION CIRCUIT
VIN
CIN
10µF
ADP2230
2 VIN1
9 VIN2
SW1 1
FB1 3
L1
2.2µH
ON
OFF 4 EN1
ON 7 EN2
OFF
PWM
PSM/PWM
6 SYNC
AGND
5
L2
2.2µH
SW2 10
FB2 8
PGND
(EPAD)
11
VOUT1
COUT1
10µF
VOUT2
COUT2
10µF
Figure 1. Fixed Output Voltage Typical Application Circuit
During logic controlled shutdown, the input is disconnected
from the output, and it draws less than 0.1 μA from the input
source. The ADP2230 operates from input voltages from 2.3 V
to 6.5 V, allowing the use of multiple alkaline, NiMH, or lithium
cells and other standard power sources.
The ADP2230 offers multiple options for setting the operating
frequency. To maximize light load efficiency, the ADP2230 can
operate at a reduced switching frequency in PSM and switch
automatically to PWM as the load increases. The ADP2230 can
be forced to operate at 2 MHz in PWM only mode when noise
considerations are more important than efficiency. The
ADP2230 can also be synchronized with a 1.5 MHz to 2.5 MHz
external clock via the SYNC pin. When using the external clock
synchronization control, both buck outputs operate in phase
with the applied clock signal.
The ADP2230 includes an internal power switch, synchronous
rectifier, and compensation to minimize external part count
and maximize efficiency. Other key protection features include
undervoltage lockout to prevent deep battery discharge, internal
soft start to prevent input current overshoot at startup, and an
integrated, switched resistor, QOD function that automatically
discharges the output when the device is disabled. Short-circuit
protection and thermal overload protection circuits prevent
damage in adverse conditions.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2014 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
1 page  
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VINx, FBx, EN2, SYNC to AGND, PGND
EN1
SWx to AGND, PGND
Operating Ambient Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Rating
−0.3 V to +7 V
−0.3 V to +6 V
−0.3 V to VINx
−40°C to +85°C
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Absolute maximum ratings apply individually only, not in
combination.
THERMAL DATA
Exceeding the junction temperature (TJ) limit can cause damage
to the ADP2230. Monitoring ambient temperature does not
guarantee that TJ is within the specified temperature limits. The
maximum ambient temperature may require derating in
applications with high power dissipation and poor thermal
resistance.
In applications with moderate power dissipation and low
printed circuit board (PCB) thermal resistance, the maximum
ambient temperature can exceed the maximum limit as long as
the junction temperature is within specification limits. The
junction temperature of the device is dependent on the ambient
temperature, the power dissipation of the device, and the
junction-to-ambient thermal resistance (θJA) of the package.
Maximum TJ is calculated from the ambient temperature (TA)
and power dissipation (PD) using the formula
TJ = TA + (PD × θJA)
(1)
θJA of the package is based on modeling and calculation using a
4-layer board. θJA is highly dependent on the application and
board layout. In applications where high maximum power
dissipation exists, close attention to thermal board design is
required. The value of θJA can vary, depending on PCB material,
layout, and environmental conditions.
ADP2230
The specified values of θJA are based on a 4-layer, 4 in. × 3 in.
circuit board. See JEDEC JESD51-7, High Effective Thermal
Conductivity Test Board for Leaded Surface Mount Packages, for
detailed information on board construction. For more
information, see AN-772 Application Note, A Design and
Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP).
ΨJB is the junction-to-board thermal characterization parameter
with units of °C/W. The ΨJB of the package is based on modeling
and calculation using a 4-layer board. The JESD51-12,
Guidelines for Reporting and Using Electronic Package Thermal
Information, states that thermal characterization parameters are
not the same as thermal resistances. ΨJB measures the
component power flowing through multiple thermal paths
rather than a single path as in junction-to-board thermal
resistance (θJB). Therefore, ΨJB thermal paths include convection
from the top of the package as well as radiation from the
package, factors that make ΨJB more useful in real-world
applications. Maximum TJ is calculated from the board
temperature (TB) and PD using the formula
TJ = TB + (PD × ΨJB)
(2)
For more information regarding ΨJB, see JESD51-12 and
JESD51-8, Integrated Circuit Thermal Test Method
Environmental Conditions—Junction-to-Board.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is,
a device soldered in a circuit board for surface-mount packages.
θJC is a parameter for surface-mount packages with top mounted
heat sinks.
Table 4. Thermal Resistance
Package Type
10-Lead, 3 mm × 3mm LFCSP
θJA
44.6
θJC Unit
5.45 °C/W
ESD CAUTION
Rev. A | Page 5 of 18
5 Page 
Data Sheet
ENx PIN (5V/DIV)
1
OUTPUT VOLTAGE (5V/DIV)
2
SWx PIN (5V/DIV)
3
INDUCTOR CURRENT (500mA/DIV)
4
TIME (40µs/DIV)
Figure 27. Startup, VOUT = 3.3 V, 800 mA
1 VOUT1 = 1.2V (2V/DIV)
VOUT2 = 3.3V SHORTED TO GROUND
(2V/DIV)
2
SWx PIN (2V/DIV)
3
INDUCTOR CURRENT (500mA/DIV)
4
TIME (400ns/DIV)
Figure 28. Short-Circuit Response
ADP2230
OUTPUT VOLTAGE (50mV/DIV)
AC-COUPLED
1
SWx PIN (2V/DIV)
3
4
INDUCTOR CURRENT (200mA/DIV)
TIME (2µs/DIV)
Figure 29. Typical PSM Operation, VOUT = 3.3 V, ILOAD = 50 mA, 150 mA
OUTPUT VOLTAGE (50mV/DIV)
AC-COUPLED
1
SWx PIN (2V/DIV)
3
INDUCTOR CURRENT (200mA/DIV)
4
TIME (2µs/DIV)
Figure 30. Typical PWM Operation, VOUT = 3.3 V, ILOAD = 400 mA
Rev. A | Page 11 of 18
11 Page | ||
| Páginas | Total 18 Páginas | |
| PDF Descargar | [ Datasheet ADP2230.PDF ] | |
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