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PDF CP2012-20A0897 Data sheet ( Hoja de datos )
| Número de pieza | CP2012-20A0897 | |
| Descripción | Multilayer Chip Couplers | |
| Fabricantes | ACX | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CP2012-20A0897 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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CP 2012 Series
Multilayer Chip Couplers
Features
Monolithic SMD with small, low-profiled, and light-weight
type.
Applications
0.8 ~ 6 GHz wireless communication systems, including
DECT/PACS/PHS/GSM/DCS phones, WLAN card,
Bluetooth modules, etc.
Specifications
ACX
Advanced Ceramic X
Part Number
Passband
(MHz)
Insertion Loss Return Loss
(dB) (dB)
CP2012-
880 ~
20A0897_
915
Q’ty/Reel (pcs)
Operating Temperature Range
Storage Temperature Range
Storage Period
Power Capacity
0.5 max.
: 4000
: -40 ~ +85 ℃
: -40 ~ +85 ℃
: 12 months max.
: 2W max.
14.0 min.
Coupling
(dB)
20.0 1.0
Part Number
CP 2012 - 20 A
0897 /LF
Isolation
(dB)
25.0 min.
Type
CP : Coupler
Dimensions ( L × W ) 2.0 × 1.25 mm
Coupling
Central Frequency
Soldering
20 : 20dB
Specification Code
0897 : 897MHz Packaging
=lead-containing
/LF=lead-free
A
T: Tape & Reel
B: Bulk
Terminal Configuration
No. Terminal Name No. Terminal Name
IN Termination
GND GND
Main Out Coupled Out
CP2012-20A0897T/LF REV:2 PAGE:1/7
1 page  
Peel-off Force
Peeling Direction
<100
Top Cover Tape
Carrier Tape
Peel-off force should be in the range of 0.1 – 0.6 N at a peel-off speed of 300±10 mm/min .
Storage Conditions
(1) Temperature: +5 ~35℃, relative humidity (RH): 45~75%.
(2) Non-corrosive environment.
ACX
Advanced Ceramic X
Notes
The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery
conditions when placing your order.
CP2012-20A0897T/LF REV:2 PAGE:5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet CP2012-20A0897.PDF ] | |
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