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PDF DEI1188 Data sheet ( Hoja de datos )
| Número de pieza | DEI1188 | |
| Descripción | 8CH GND/OPEN DISCRETE INTERFACE IC W/ EXT HV PROTECTION | |
| Fabricantes | Device Engineering | |
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Device
Engineering
Incorporated
385 East Alamo Drive
Chandler, AZ 85225
Phone: (480) 303-0822
Fax: (480) 303-0824
E-mail: [email protected]
DEI1188
8CH GND/OPEN DISCRETE
INTERFACE IC W/ EXT HV
PROTECTION
FEATURES
• Eight discrete inputs
o Senses GND/OPEN discrete signals.
o Meet input threshold and hysteresis requirements specified per AirBus ABD0100H specification.
Thresholds: 4.5V/10.5V, Hysteresis: 3V
o 1mA input current to prevent dry relay contacts.
o Internal isolation diode.
o Uses external series 3Kohm resistors on inputs to implement lightning transient immunity of 1600V and higher.
i.e.: DO160E, Section 22, Levels 4 and 5.
o Inputs protected from Lightning Induced Transients per DO160E, Section 22, Cat A3 and B3 plus waveform 5A
to 500V.
• Serial I/O interface to read data register
o Direct interface to Serial Peripheral Interface (SPI) port.
o TTL/CMOS compatible inputs and Tristate output
o 10MHz Max Data Rate
o Serial input to expand Shift Register
• Pin compatible with DEI1066
• Logic Supply Voltage (VCC):
3.3V +/-5%
• Analog Supply Voltage (VDD):
12.0V to 16.5V
• 16L SOIC EP package
PIN ASSIGNMENTS
DIN1
DIN2
DIN3
DIN4
DIN5
DIN6
DIN7
DIN8
1
DEI1188
16 VDD
GND
VCC
GND
SDI
/CS
SCLK
SDO
Figure 1 DEI1188 Pin Assignment (16 Lead SOIC)
©2009 Device Engineering Inc.
1 of 12
DS-MW-01188-01 Rev. D
07/21/2009
1 page  
/CS
SCLK
X
DIN[1:8] X VALID
X
SDI
SDO
X
X
DIN8
DIN7 DIN6 DIN5 DIN4 DIN3
DIN2 DIN1
DIN inputs latched into DATA S-Reg
Figure 4 Read Data Register
X
/CS
SCLK
X
DIN[1:8] X VALID
X
SDI
SDO
X
SI8
SI7 SI6 SI5 SI4 SI3
SI2 SI1
X
DIN8 DIN7 DIN6 DIN5 DIN4 DIN3 DIN2 DIN1
SI8
SI7
SI6
SI5
SI4
SI3
SI2
SI1
DIN inputs latched into DATA S-Reg
SDI data shifted to SDO after 8 bit delay
Figure 5 Read Data Register, 16 Bit Daisy Chain
X
©2009 Device Engineering Inc.
5 of 12
DS-MW-01188-01 Rev. D
07/21/2009
5 Page 
Package Power Dissipation
The DEI1188 power dissipation varies with operating conditions. Figure 11 shows the device package power dissipation for
various operating conditions. This includes the contributions from Supply currents and DIN Input currents. The curves are as
follows:
Table 7 Legend for Power Dissipation Curves
CURVE ID
GND/OPEN-Nom
SUPPLY VOLTAGE, TEMPERATURE,
IC VARIATION
3.3V, 12V / 27ºC / typical IC parameters
GND/OPEN-Wst
3.3V, 16.5V / 125ºC /
Worst case IC parameters
DEI1188 Pwr Dissipation
700
600
500
Pwr 400
Dissipation
(mW)
300
200
100
0
012345678
Number CH Active = GND
GND/OPN-Nom
GND/OPN-Wst
Figure 11 Power Dissipation for Various Conditions
©2009 Device Engineering Inc.
11 of 12
DS-MW-01188-01 Rev. D
07/21/2009
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet DEI1188.PDF ] | |
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