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Número de pieza | IXD604 | |
Descripción | 4-Ampere Dual Low-Side Ultrafast MOSFET Drivers | |
Fabricantes | IXYS | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de IXD604 (archivo pdf) en la parte inferior de esta página. Total 13 Páginas | ||
No Preview Available ! INTEGRATED CIRCUITS DIVISION
Features
• 4A Peak Source/Sink Drive Current
• Wide Operating Voltage Range: 4.5V to 35V
• -40°C to +125°C Extended Operating Temperature
Range
• Logic Input Withstands Negative Swing of up to 5V
• Outputs May be Connected in Parallel for Higher
Drive Current
• Matched Rise and Fall Times
• Low Propagation Delay Time
• Low, 10A Supply Current
• Low Output Impedance
Applications
• Efficient Power MOSFET and IGBT Switching
• Switch Mode Power Supplies
• Motor Controls
• DC to DC Converters
• Class-D Switching Amplifiers
• Pulse Transformer Driver
IXD_604
4-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
Description
The IXDD604/IXDF604/IXDI604/IXDN604 dual
high-speed gate drivers are especially well suited for
driving the latest IXYS MOSFETs and IGBTs. Each of
the two outputs can source and sink 4A of peak
current while producing voltage rise and fall times of
less than 10ns. The input of each driver is virtually
immune to latch up, and proprietary circuitry
eliminates cross conduction and current
“shoot-through.” Low propagation delay and fast,
matched rise and fall times make the IXD_604 family
ideal for high-frequency and high-power applications.
The IXDD604 is a dual non-inverting driver with an
enable. The IXDN604 is a dual non-inverting driver,
the IXDI604 is a dual inverting driver, and the IXDF604
has one inverting driver and one non-inverting driver.
The IXD_604 family is available in a standard 8-pin
DIP (PI), 8-pin SOIC (SIA), 8-pin Power SOIC with an
exposed metal back (SI), and an 8-pin DFN (D2)
package.
Ordering Information
Part Number
IXDD604D2TR
IXDD604PI
IXDD604SI
IXDD604SITR
IXDD604SIA
IXDD604SIATR
IXDF604PI
IXDF604SI
IXDF604SITR
IXDF604SIA
IXDF604SIATR
IXDI604PI
IXDI604SI
IXDI604SITR
IXDI604SIA
IXDI604SIATR
IXDN604PI
IXDN604SI
IXDN604SITR
IXDN604SIA
IXDN604SIATR
Logic
Configuration
ENA
INA
ENB
INB
A
B
OUTA
OUTB
INA A
OUTA
INB B
OUTB
INA A
OUTA
INB B
OUTB
INA A
OUTA
INB B
OUTB
DS-IXD_604-R07
Package Type
8-Pin DFN
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
www.ixysic.com
Packing
Method
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Quantity
2000
50
100
2000
100
2000
50
100
2000
100
2000
50
100
2000
100
2000
50
100
2000
100
2000
1
1 page INTEGRATED CIRCUITS DIVISION
1.7 Thermal Characteristics
Package
D2 (8-Pin DFN)
PI (8-Pin DIP)
SI (8-Pin Power SOIC)
SIA (8-Pin SOIC)
SI (8-Pin Power SOIC)
Parameter
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
Symbol
JA
JC
2 IXD_604 Performance
2.1 Timing Diagrams
Rating
35
125
85
120
10
VIH
INx
VIL
90%
OUTx
10%
toffdly
tf
tondly
tr
VIH
INx
VIL
90%
OUTx
10%
tondly
tr
IXD_604
Units
°C/W
°C/W
toffdly
tf
2.2 Characteristics Test Diagram
0.1μF 10μF
+
VCC
-
VIN
INA VCC OUTA
INB
VCC
ENA
OUTB
CLOAD
Tektronix
Current Probe
6302
ENB
GND
CLOAD
Tektronix
Current Probe
6302
R07 www.ixysic.com
5
5 Page INTEGRATED CIRCUITS DIVISION
5.4 Mechanical Dimensions
5.4.1 SIA (8-Pin SOIC)
Pin 8
1.270 REF
(0.050)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
4.928 ± 0.254
(0.194 ± 0.010)
1.346 ± 0.076
(0.053 ± 0.003)
0.762 ± 0.254
(0.030 ± 0.010)
0.559 ± 0.254
(0.022 ± 0.010)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
IXD_604
PCB Land Pattern
0.60
(0.024)
5.40
(0.213)
1.55
(0.061)
1.27
(0.050)
Dimensions
mm
(inches)
5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back)
3.80
(0.150)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
0.762 ± 0.254
(0.030 ± 0.010)
5.40 2.75
(0.209) (0.108)
1.55
(0.061)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
1.270 REF
(0.050)
4.928 ± 0.254
(0.194 ± 0.010)
1.346 ± 0.076
(0.053 ± 0.003)
7º
1.27
(0.050)
0.60
(0.024)
Recommended PCB Land Pattern
2.540 ± 0.254
(0.100 ± 0.010)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
3.556 ± 0.254
(0.140 ±0.010)
Dimensions
mm
(inches)
Note: The exposed metal pad on the back of the SI package should be connected to GND. It is not suitable for
carrying current.
R07 www.ixysic.com
11
11 Page |
Páginas | Total 13 Páginas | |
PDF Descargar | [ Datasheet IXD604.PDF ] |
Número de pieza | Descripción | Fabricantes |
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