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PDF DTC143EE Data sheet ( Hoja de datos )

Número de pieza DTC143EE
Descripción Digital Transistors
Fabricantes ON Semiconductor 
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No Preview Available ! DTC143EE Hoja de datos, Descripción, Manual

MUN2232, MMUN2232L,
MUN5232, DTC143EE,
DTC143EM3, NSBC143EF3
Digital Transistors (BRT)
R1 = 4.7 kW, R2 = 4.7 kW
NPN Transistors with Monolithic Bias
Resistor Network
This series of digital transistors is designed to replace a single
device and its external resistor bias network. The Bias Resistor
Transistor (BRT) contains a single transistor with a monolithic bias
network consisting of two resistors; a series base resistor and a base
emitter resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce
both system cost and board space.
Features
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
S and NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC-Q101 Qualified
and PPAP Capable
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Max
Unit
CollectorBase Voltage
VCBO
50
Vdc
CollectorEmitter Voltage
VCEO
50
Vdc
Collector Current Continuous
IC 100 mAdc
Input Forward Voltage
VIN(fwd)
30
Vdc
Input Reverse Voltage
VIN(rev)
10
Vdc
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
PIN CONNECTIONS
PIN 3
COLLECTOR
PIN 1
BASE
R1
(OUTPUT)
(INPUT) R2
PIN 2
EMITTER
(GROUND)
MARKING DIAGRAMS
XX MG
G
1
SC59
CASE 318D
STYLE 1
XXX MG
G
1
SOT23
CASE 318
STYLE 6
XX MG
G
1
XX M
1
SC70/SOT323
CASE 419
STYLE 3
SC75
CASE 463
STYLE 1
XX M
1
XM 1
SOT723
CASE 631AA
STYLE 1
SOT1123
CASE 524AA
STYLE 1
XXX
M
G
= Specific Device Code
= Date Code*
= PbFree Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking, and shipping information in
the package dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
March, 2013 Rev. 2
1
Publication Order Number:
DTC143E/D

1 page




DTC143EE pdf
MUN2232, MMUN2232L, MUN5232, DTC143EE, DTC143EM3, NSBC143EF3
TYPICAL CHARACTERISTICS
MUN2232, MMUN2232L, MUN5232, DTC143EE, DTC143EM3
1
IC/IB = 10
1000
VCE = 10 V
100
25°C
150°C
55°C
0.1 150°C
25°C
55°C
10
1
0.01
0
10 20 30 40
IC, COLLECTOR CURRENT (mA)
Figure 2. VCE(sat), vs. IC
0.1
50 0.1
1 10
IC, COLLECTOR CURRENT (mA)
Figure 3. DC Current Gain
100
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
0
f = 10 kHz
IE = 0 A
TA = 25°C
100
150°C
10
25°C
55°C
1
10 20 30 40
VR, REVERSE VOLTAGE (V)
Figure 4. Output Capacitance
0.1
VO = 5 V
0.01
50 0
1
23
45
Vin, INPUT VOLTAGE (V)
Figure 5. Output Current vs. Input Voltage
100
10 25°C
55°C
1
150°C
VO = 0.2 V
0.1
0 10 20 30 40 50
IC, COLLECTOR CURRENT (mA)
Figure 6. Input Voltage vs. Output Current
http://onsemi.com
5

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DTC143EE arduino
MUN2232, MMUN2232L, MUN5232, DTC143EE, DTC143EM3, NSBC143EF3
PACKAGE DIMENSIONS
X
D
b1
3
Y
E
2X e
12
TOP VIEW
2X b
0.08 X Y
3X L
1
3X L2
BOTTOM VIEW
SOT723
CASE 631AA01
ISSUE D
A
HE
C
SIDE VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MILLIMETERS
DIM MIN NOM MAX
A 0.45 0.50 0.55
b 0.15 0.21 0.27
b1 0.25 0.31 0.37
C 0.07 0.12 0.17
D 1.15 1.20 1.25
E 0.75 0.80 0.85
e 0.40 BSC
H E 1.15 1.20 1.25
L 0.29 REF
L2 0.15 0.20 0.25
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
RECOMMENDED
SOLDERING FOOTPRINT*
2X 0.27
2X
0.40
PACKAGE
OUTLINE
1.50
3X 0.52
0.36
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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