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T25 데이터시트 PDF




STMicroelectronics에서 제조한 전자 부품 T25은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

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부품번호 T25 기능
기능 TRIACs
제조업체 STMicroelectronics
로고 STMicroelectronics 로고


T25 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.




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T25 데이터시트, 핀배열, 회로
BTA24, BTB24, BTA25
BTA26, BTB26, T25
25 A standard and Snubberless™ triacs
Features
High current triac
Low thermal resistance with clip bonding
High commutation (4 quadrant) or very high
commutation (3 quadrant) capability
BTA series UL1557 certified (File ref: 81734)
Packages are RoHS (2002/95/EC) compliant
Applications
Applications include the ON/OFF function in
applications such as static relays, heating
regulation, induction motor starting circuits, etc.,
or for phase control operation in light dimmers,
motor speed controllers, and silmilar.
The snubberless versions (BTA/BTB...W and T25
series) are especially recommended for use on
inductive loads, due to their high commutation
performances. The BTA series provides an
insulated tab (rated at 2500 VRMS).
A2
G
A1
A2
A1
A2
G
TO-220AB Insulated
(BTA24)
A1
G A2
A1
A2
G
TO-220AB
(BTB24)
RD91
(BTA25)
A2
A1
A2
G
TOP3 Insulated
(BTA26)
A2
Description
Available either in through-hole or surface-mount
packages, the BTA24, BTB24, BTA25, BTA26,
BTB26 and T25 triac series is suitable for general
purpose mains power AC switching.
A1 A2
G
D2PAK
(T25)
A1
A2
G
TOP3
(BTB26)
Table 1. Device summary
Symbol
Parameter
BTA24(1) BTB24 BTA25(1) BTA26(1) BTB26 T25
Unit
IT(RMS)
RMS on-state
current
VDRM/VRRM
Repetitive peak
off-state voltage
IGT (Snubberless)
Triggering gate
current
IGT (Standard)
Triggering gate
current
25 25 25
25 25 25 A
600 / 800 600 / 800 600 / 800 600(2) / 800 600 600 / 800 V
35 / 50 35 / 50
50
35 / 50
-
35 mA
- 50 50 50 50 - mA
1. Insulated packages
2. 600 V version available only with IGT = 50 mA (Snubberless and Standard)
TM: Snubberless is a trademark of STMicroelectronics
July 2007
Rev 10
1/12
www.st.com
12




T25 pdf, 반도체, 판매, 대치품
Characteristics
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Figure 1. Maximum power dissipation versus Figure 2. RMS on-state current versus case
RMS on-state current (full cycle)
temperature (full cycle)
P(W)
30
25
20
IT(RMS)(A)
30
25
20
BTA24
BTB26
15 15 BTB24 / T25xx /
BTA25 / BTA26
10 10
5
0
0
5
IT(RMS)(A)
TC(°C)
0
5 10 15 20 25
0
25
50
75
100
125
Figure 3.
D2PAK RMS on-state current versus Figure 4.
ambient temperature (printed
circuit board FR4, copper
thickness: 35µm) (full cycle)
Relative variation of thermal
impedance versus pulse
duration
IT(RMS)(A)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
25
Tamb(°C)
50 75
D2PAK
(S=1cm2)
100 125
1E+0
K=[Zth/Rth]
Zth(j-c)
1E-1
Zth(j-a)
BTA / BTB24 / T25
1E-2
1E-3
1E-3
1E-2
Zth(j-a)
BTA26
tp(s)
1E-1
1E+0
1E+1
1E+2 5E+2
Figure 5. On-state characteristics
(maximum values)
Figure 6. Surge peak on-state current
versus number of cycles
ITM(A)
300
100
Tj max.
Vto = 0.85V
Rd = 16 mΩ
Tj = Tj max.
10 Tj = 25°C.
VTM(V)
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
ITSM(A)
300
250
200
150
100
Non repetitive
Tj initial=25°C
Repetitive
TC=75°C
50
0
1
Number of cycles
10 100
t=20ms
One cycle
1000
4/12

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T25 전자부품, 판매, 대치품
BTA24, BTB24, BTA25, BTA26, BTB26, T25
3 Package information
Package information
Epoxy meets UL94,V0
Cooling method: C
Recommended torque value: 0.4 - 0.5 Nm (TO-220AB), 0.9 - 1.2 Nm (TOP3 and RD91)
Maximum torque value for BTB24 is 0.5 Nm
Table 7. D2PAK dimensions
DIMENSIONS
REF.
Millimeters
Inches
L2
L
L3
Min. Typ. Max. Min. Typ. Max.
A
A 4.30
4.60 0.169
0.181
E
C2
A1 2.49
2.69 0.098
0.106
A2 0.03
0.23 0.001
0.009
D B 0.70
0.93 0.027
0.037
B2 1.25 1.40
0.048 0.055
A1
B2
B
G
C
2mm min.
FLAT ZONE
A2
R
V2
C 0.45
C2 1.21
D 8.95
E 10.00
G 4.88
L 15.00
L2 1.27
0.60 0.017
1.36 0.047
9.35 0.352
10.28 0.393
5.28 0.192
15.85 0.590
1.40 0.050
0.024
0.054
0.368
0.405
0.208
0.624
0.055
L3 1.40
1.75 0.055
0.069
R 0.40
0.016
V2 0°
8° 0°
Figure 14. D2PAK footprint dimensions (in millimeters)
16.90
10.30
8.90
5.08
1.30
3.70
7/12

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