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PDF CS20N50ANH Data sheet ( Hoja de datos )

Número de pieza CS20N50ANH
Descripción Silicon N-Channel Power MOSFET
Fabricantes Huajing Discrete Devices 
Logotipo Huajing Discrete Devices Logotipo




1. CS20N50ANH pdf datasheet






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Huajing Discrete Devices
Silicon N-Channel Power MOSFET
R
CS20N50 ANH
General Description
CS20N50 ANH, the silicon N-channel Enhanced
VDMOSFETs, is obtained by the self-aligned planar Technology
which reduce the conduction loss, improve switching
VDSS
ID
PD (TC=25)
RDS(ON)Typ
performance and enhance the avalanche energy. The transistor
can be used in various power switching circuit for system
miniaturization and higher efficiency. The package form is TO-3PN,
which accords with the RoHS standard..
Features
l Fast Switching
500
20
230
0.25
l Low ON Resistance(Rdson0.3)
l Low Gate Charge (Typical Data:63nC)
l Low Reverse transfer capacitances(Typical:25pF)
l 100% Single Pulse avalanche energy Test
Applications
Power switch circuit of electron ballast and adaptor.
AbsoluteTc= 25unless otherwise specified):
Symbol Parameter
VDSS
ID
IDMa1
VGS
EAS a2
EAR a1
IAR a1
dv/dt a3
PD
TJTstg
TL
Drain-to-Source Voltage
Continuous Drain Current
Continuous Drain Current TC = 100 °C
Pulsed Drain Current
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Energy ,Repetitive
Avalanche Current
Peak Diode Recovery dv/dt
Power Dissipation
Derating Factor above 25°C
Operating Junction and Storage Temperature Range
MaximumTemperature for Soldering
Rating
500
20
12.5
80
±30
1500
90
4.3
5.0
230
1.84
15055 to 150
300
V
A
W
Units
V
A
A
A
V
mJ
mJ
A
V/ns
W
W/
WUX I CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Page 1 of 10 2012

1 page




CS20N50ANH pdf
Huajing Discrete Devices
R CS20N50 ANH
1000
100
TRANSCONDUCTANCE MAY LIMIT
CURRENT IN THIS REGION
FOR TEMPERATURES
ABOVE 25DERATE PEAK
CURRENT AS FOLLOWS:
I = I 25
150 TC
125
10
1.00E-05
100
10
1.00E-04
1.00E-03
1.00E-02
t Pulse Width , Seconds
1.00E-01
Figure 6 Maximun Peak Current Capability
1.4
PULSE DURATION = 250μs
DUTY CYCLE = 0.5%MAX
VDS=50V
1.2
1
0.8
1.00E+00
1.00E+01
PULSE DURATION = 10μs
DUTY FACTOR = 0.5%MAX
Tc =25
ID=20A
ID=10A
0.6 ID=5A
1
+150
0.4
+25
0.1
2
-55
3456789
Vgs , Gate to Source Voltage , Volts
Figure 7 Typical Transfer Characteristics
0.8
PULSE DURATION = 10μs
DUTY CYCLE= 0.5%MAX
Tc =25
0.6
0.2
0
10 4 6 8 10 12 14
Vgs , Gate to Source Voltage Volts
Figure 8 Typical Drain to Source ON Resistance vs Gate Voltage
and Drain Current
3
VGS=10V ID=10A
2.5
2
0.4
VGS=10V
1.5
VGS=20V
1
0.2
0.5
0
0 20 40 60
Id , Drain Current , Amps
Figure 9 Typical Drain to Source ON Resistance
vs Drain Current
80
0
-100 -50 0 50 100 150 200
Tj, Junction temperature , C
Figure 10 Typical Drian to Source on Resistance
vs Junction Temperature
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Page 5 of 10 2012

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