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PDF CURNM103-HF Data sheet ( Hoja de datos )
| Número de pieza | CURNM103-HF | |
| Descripción | SMD Ultra Fast Recovery Rectifiers | |
| Fabricantes | Comchip Technology | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CURNM103-HF (archivo pdf) en la parte inferior de esta página. Total 4 Páginas | ||
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SMD Ultra Fast Recovery Rectifiers
CURNM101-HF Thru. CURNM105-HF
Forward current: 1.0A
Reverse voltage: 200 to 1000V
RoHS Device
Halogen Free
1206-S/SOD-123
Features
- GPRC(Glass passivated rectifier chip) inside.
- Glass passivated cavity-free junction.
- Low power loss, High efficiency.
- High current capability
- Plastic package has underwriters laboratory
flammability classification 94V-0.
Mechanical Data
- Case: Packed with FRP substrate and
epoxy underfilled.
- Terminals: Pure Tin plated (Lead-Free), solderable
per MIL-STD-750, method 2026.
- Polarity: Cathode band laser marking.
- Weight: 0.012 gram (approx).
0.075 (1.90)
0.059 (1.50)
0.138 (3.50)
0.130 (3.30)
R 0.016 (0.40)
0.059(1.50)
Typ.
0.035 (0.90)
0.020 (0.50)
0.046 (1.16)
0.030 (0.76)
0.035 (0.90)
0.020 (0.50)
Dimensions in inches and (millimeter)
Circuit diagram
Absolute Maximum Ratings (at TA=25°C unless otherwise noted)
Parameter
Symbol
Conditions
CURNM CURNM CURNM CURNM CURNM
101-HF 102-HF 103-HF 104-HF 105-HF
Unit
Repetitive peak reverse voltage
VRRM
200 400 600 800 1000 V
Average forward current
IO
1.0 A
Peak forward surge current
IFSM 8.3ms single half sine-wave
15
A
Reverse recovery time
Operating junction temperature
range
Trr IF=0.5A,IR=1.0A,Irr=0.25A
TJ
50 75
-65 to +175
nS
°C
Storage temperature range
TSTG
-65 to +175
°C
Electrical Characteristics (at TA=25°C unless otherwise noted)
Parameter
Forward voltage
Symbol
Conditions
VF IF =1.0A
Type
CURNM101-HF
CURNM102-HF
CURNM103-HF
CURNM104-HF
CURNM105-HF
Repetitive peak reverse current
IRRM VR =Max. VRRM, TA=25°C
MIN.
-
-
-
-
-
-
TYP.
0.95
1.10
1.50
1.50
1.50
0.10
MAX.
1.00
1.25
1.70
1.70
1.70
5
Unit
V
uA
Junction capacitance
CJ VR=4V, f=1.0MHZ
- 9 - pF
Thermal Resistance
RθJA Junction to ambient (Note)
RθJL Junction to lead (Note)
- 123 -
- 45 -
Notes: 1. Thermal resistance from junction to ambient and from junction to lead P.C.B. monuted on 0.2×0.2”(5.0*5.0mm) copper pad areas.
Company reserves the right to improve product design , functions and reliability without notice.
QW-JU006
Comchip Technology CO., LTD.
°C/W
REV:A
Page 1
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet CURNM103-HF.PDF ] | |
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