Datasheet.kr   

MADP-030015-1314 데이터시트 PDF




MA-COM에서 제조한 전자 부품 MADP-030015-1314은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 MADP-030015-1314 자료 제공

부품번호 MADP-030015-1314 기능
기능 PIN Diodes
제조업체 MA-COM
로고 MA-COM 로고


MADP-030015-1314 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.




전체 4 페이지수

미리보기를 사용할 수 없습니다

MADP-030015-1314 데이터시트, 핀배열, 회로
MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
Features
0603 Outline
Surface Mount
15µm I-Region Length Devices
No Wirebonds Required
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Average and Peak Power Handling
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM Technology Solutions patented
HMICTM process. This device features two silicon pedes-
tals embedded in a low loss, low dispersion glass. The
diode is formed on the top of one pedestal and connec-
tions to the backside of the device are facilitated by mak-
ing the pedestal sidewalls electrically conductive. Selective
backside metallization is applied producing a surface
mount device. This vertical topology provides for excep-
tional heat transfer. The topside is fully encapsulated
with silicon nitride and has an additional polymer layer for
scratch and impact protection. These protective coatings
prevent damage to the junction and the anode air-bridge
during handling and assembly.
Applications
These packageless devices are suitable for usage in
moderate incident power, 50dBm/C.W. or where the
peak power is 75dBm, pulse width is 1μS, and duty
cycle is 0.01%. Their low parasitic inductance, 0.4 nH,
and excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
Absolute Maximum Ratings1 @TAMB = +25°C
(unless otherwise specified)
Parameter
Absolute Maximum
Forward Current
500 mA
Reverse Voltage
- 115 V
Operating Temperature
-55°C to +125°C
Storage Temperature
-55 °C to +150°C
Junction Temperature
+175°C
C.W. Incident Power
50dBm
Mounting Temperature
+280°C for 30 seconds
1) Exceeding these limits may cause in permanent damage
Rev. V6
Case Style ODS 1314
Chip Dimensions
DIM INCHES
MM
Min Max Min Max
A 0.060 0.062 1.525 1.575
B 0.031 0.032 0.775 0.825
C 0.004 0.008 0.102 0.203
D 0.019 0.021 0.475 0.525
E 0.019 0.021 0.475 0.525
F 0.019 0.021 0.475 0.525
G 0.029 0.031 0.725 0.775
Notes:
1) Backside metal: 0.1microns thick.
2) Yellow area with hatch lines indicate backside ohmic gold
contacts.
3) Both devices have same outline dimensions ( A to G).
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaran-
teed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifica-
tions are typical. Mechanical outline has been fixed. Engineering samples and/or test data
may be available. Commitment to produce in volume is not guaranteed.
North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.




MADP-030015-1314 pdf, 반도체, 판매, 대치품
MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
Rev. V6
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently
located on the bottom surface of these devices and are removed from the active junction locations. These devices are well
suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is
recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per
manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of
60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it
is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads
are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die,
apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a
time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat
to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads
can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 , “Surface Mounting
Instructions“ and can viewed on the MA-COM website @ www.macomtech.com
Ordering Information
Gel Pack
MADP-017015-13140G
MADP-030015-13140G
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaran-
teed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifica-
tions are typical. Mechanical outline has been fixed. Engineering samples and/or test data
may be available. Commitment to produce in volume is not guaranteed.
North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.

4페이지












구       성 총 4 페이지수
다운로드[ MADP-030015-1314.PDF 데이터시트 ]

당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는

포괄적인 데이터시트를 제공합니다.


구매 문의
일반 IC 문의 : 샘플 및 소량 구매
-----------------------------------------------------------------------

IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한
광범위한 전력 반도체를 판매합니다.

전력 반도체 전문업체

상호 : 아이지 인터내셔날

사이트 방문 :     [ 홈페이지 ]     [ 블로그 1 ]     [ 블로그 2 ]



관련 데이터시트

부품번호상세설명 및 기능제조사
MADP-030015-1314

PIN Diodes

MA-COM
MA-COM

DataSheet.kr       |      2020   |     연락처      |     링크모음      |      검색     |      사이트맵