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PDF L88MS33T Data sheet ( Hoja de datos )
| Número de pieza | L88MS33T | |
| Descripción | 3.3 V/ 0.5 A Low Dropout Voltage Regulator with On/Off Function | |
| Fabricantes | Sanyo Semicon Device | |
| Logotipo |  |
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Ordering number: EN5516
Monolithic Linear IC
L88MS33T
3.3 V, 0.5 A Low Dropout Voltage Regulator
with On/Off Function
Overview
The L88MS33T is a low dropout voltage regulator with an
output voltage of 3.3 V (standard), with an on-chip on/off
function to maximize equipment power saving effectiveness.
Because it can operate with a low input-output voltage
difference, it contributes to smaller and more efficient set
power supplies, optimum for audio-visual and office
automation equipment.
Package Dimensions
unit : mm
3103-TP-5H
[L88MS33T]
Functions
. Output voltage: 3.3 V
. On/off control of output voltage by strobe pin (active low)
. 500 mA output current
Features
. Low minimum input-output voltage differential (0.4 V typ)
enables to save energy and miniaturize transformer size.
. Quiescent current is low with output off.
. Set size can be miniaturized with compact TP-5H power
. package.
Surface mounting on board permits allowable power
dissipation to be raised.
. Enhanced mount flexibility with range of formed products.
. On-chip protective circuitry (fold back short circuit, thermal
. over load).
External noise suppression pin provided.
Pin Assignment
SANYO : TP-5H
Specifications
Top view
Maximum Ratings at Ta = 25°C
Parameter
Input voltage
Strobe pin input voltage
Allowable power dissipation
Symbol
VIN max
VST max
Pd max
Thermal resistance (junction-atmosphere)
Thermal resistance (junction-to-case)
Operating temperature
Storage temperature
θj-a
θj-c
Topr
Tstg
Conditions
Ta % 25°C, no heat sink
Tc = 25°C, with infinite heat sink
Ratings
18
VIN max
1
6.25
125
20
–20 to +85
–55 to +150
Unit
V
V
W
W
°C/W
°C/W
°C
°C
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110 JAPAN
31097HA(II) No.5516-1/7
1 page  
Pd max – Ta
With infinite heat sink
L88MS33T
Mounted on copper-clad
area of 2,000 mm2
Mounted on copper-clad
area 740 mm2
Mounted on copper-clad
area 180 mm2
Mounted on copper-clad
area 36 mm2
No heat sink
Ambient temperature, Ta – °C
1) The allowable power dissipation is 1.0 W (Ta = 25°C) with no fin attached, but when mounted on a hybrid IC board or
printed circuit board, high allowable power dissipation is achieved, despite the compact package. The graph below depicts the
relationship between the copper-clad area and allowable power dissipation when mounted on a glass epoxy board
(50 × 5 0 × 0.8 mm3) with a copper thickness of 18 µm.
Pd max – S
Board
Copper-clad area S
(mm2)
Copper-clad area, S – mm2
2) Pd is the value for when the solder on the surface of the IC heat sink has melted completely and the surface mount is
horizontal.
3) Please be advised that the flow solder application system (full-heat method) cannot be recommended.
Lead Formings
MA forming
LR forming
FA forming
No.5516-5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet L88MS33T.PDF ] | |
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