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SKI04044 데이터시트 PDF




Sanken에서 제조한 전자 부품 SKI04044은 전자 산업 및 응용 분야에서
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부품번호 SKI04044 기능
기능 N-channel Trench Power MOSFET
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SKI04044 데이터시트, 핀배열, 회로
40 V, 80 A, 4.1 mΩ Low RDS(ON)
N ch Trench Power MOSFET
SKI04044
Features
V(BR)DSS --------------------------------- 40 V (ID = 100 µA)
ID ---------------------------------------------------------- 80 A
RDS(ON) ----------5.2 mΩ max. (VGS = 10 V, ID = 42.8 A)
Qg------16.0 nC (VGS = 4.5 V, VDS = 20 V, ID = 42.8 A)
Low Total Gate Charge
High Speed Switching
Low On-Resistance
Capable of 4.5 V Gate Drive
100 % UIL Tested
RoHS Compliant
Package
TO-263
(4)
D
(1) (2) (3)
GDS
Applications
DC-DC converters
Synchronous Rectification
Power Supplies
Equivalent circuit
D(2)(4)
G(1)
S(3)
Not to scale
Absolute Maximum Ratings
Unless otherwise specified, TA = 25 °C
Parameter
Symbol
Drain to Source Voltage
VDS
Gate to Source Voltage
VGS
Continuous Drain Current
ID
Pulsed Drain Current
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
IDM
IS
ISM
Single Pulse Avalanche Energy
EAS
Avalanche Current
Power Dissipation
Operating Junction Temperature
Storage Temperature Range
IAS
PD
TJ
TSTG
Test conditions
TC = 25 °C
PW 100µs
Duty cycle 1 %
PW 100µs
Duty cycle 1 %
VDD = 20 V, L = 1 mH,
IAS = 9.4 A, unclamped,
RG = 4.7 Ω,
Refer to Figure 1
TC = 25 °C
Rating
40
± 20
80
161
80
161
89
16.7
90
150
55 to 150
Unit
V
V
A
A
A
A
mJ
A
W
°C
°C
SKI04044-DS Rev.1.3
May. 22, 2014
SANKEN ELECTRIC CO.,LTD.
http://www.sanken-ele.co.jp
1




SKI04044 pdf, 반도체, 판매, 대치품
SKI04044
RDS(ON)-ID characteristics (typical)
VGS=10V
10
9
8
Tc = 125
7
6 75
5 25
4
3
2
1
0
0 20 40 60 80 100 120 140 160
ID (A)
VDS-VGS characteristics (typical)
Tc=25
0.4
0.3
0.2
0.1
0.0
0
ID=42.8A
ID=35.4A
ID=21.4A
5 10
VGS (V)
15
RDS(ON)-ID characteristics (typical)
VGS=4.5V
25
20
15 Tc = 125
75
10 25
5
0
0 20 40 60 80 100 120 140 160
ID (A)
IDR-VSD characteristics (typical)
Tc=25
160
140 VGS=10V
120
100
VGS=4.5V
80
60 3V
40 0V
20
0
0 0.5 1 1.5
VSD (V)
160
140
120
100
80
60
40
20
0
0
ID-VGS characteristics (typical)
VDS=5V
Tc =125
75
25
12345
VGS (V)
IDR-VSD characteristics (typical)
VDS=0V
160
140
120
100
80 Tc =125
60 75
40 25
20
0
0 0.5 1 1.5
VSD (V)
Capacitance-VDS characteristics (typical)
10000
Ciss
1000
Coss
VGS - Qg characteristics (typical)
15
10
Vth-Tc characteristics (typical)
3
2
100
Ta=25
VGS=0V
f =1MHz
10
0
10
Crss
20 30
VDS (V)
40
RDS(ON)-Tc characteristics (typical)
10
8
6
4
2 ID=42.8A
VGS=10V
0
25 50 75 100 125 150
Tc ()
5
Tc=25
VDS=20V
ID=42.8A
0
0 10 20 30 40
Qg (nC)
RDS(ON)-Tc characteristics (typical)
12
10
8
6
4
2 ID=21.4A
VGS=4.5V
0
25 50 75 100 125 150
Tc ()
SKI04044-DS Rev.1.3
May. 22, 2014
SANKEN ELECTRIC CO.,LTD.
1
ID=650uA
VGS=VDS
0
25 50 75 100 125 150
Tc ()
BVDSS-Tc characteristics (typical)
52
50
48
46
ID=1mA
44 VGS=0V
42
25 50 75 100 125 150
Tc ()
4

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SKI04044 전자부품, 판매, 대치품
SKI04044
OPERATING PRECAUTIONS
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely
depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation
range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to
assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric
current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused
due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum
values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power
devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly.
Because reliability can be affected adversely by improper storage environments and handling methods, please
observe the following cautions.
Cautions for Storage
Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
Avoid locations where dust or harmful gases are present and avoid direct sunlight.
Reinspect for rust on leads and solderability of the products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power
surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are
within the ratings specified by Sanken for the products.
Remarks About Using Thermal Silicone Grease
When thermal silicone grease is used, it shall be applied evenly and thinly. If more silicone grease than required is
applied, it may produce excess stress.
The thermal silicone grease that has been stored for a long period of time may cause cracks of the greases, and it
cause low radiation performance. In addition, the old grease may cause cracks in the resin mold when screwing the
products to a heatsink.
Fully consider preventing foreign materials from entering into the thermal silicone grease. When foreign material
is immixed, radiation performance may be degraded or an insulation failure may occur due to a damaged insulating
plate.
The thermal silicone greases that are recommended for the resin molded semiconductor should be used.
Our recommended thermal silicone grease is the following, and equivalent of these.
Type
Suppliers
G746 Shin-Etsu Chemical Co., Ltd.
YG6260 Momentive Performance Materials Japan LLC
SC102 Dow Corning Toray Co., Ltd.
Soldering
When soldering the products, please be sure to minimize the working time, within the following limits:
Reflow
Preheat ; 180 °C / 90 ± 30 s
Solder heating ; 250 °C / 10 ± 1s (260 °C peak, 2 times)
Soldering iron ; 380 ± 10 °C / 3.5 ± 0.5s (1 time)
Electrostatic Discharge
When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ
of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
Workbenches where the products are handled should be grounded and be provided with conductive table and floor
mats.
When using measuring equipment such as a curve tracer, the equipment should be grounded.
When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent
leak voltages generated by them from being applied to the products.
The products should always be stored and transported in Sanken shipping containers or conductive containers, or
be wrapped in aluminum foil.
SKI04044-DS Rev.1.3
May. 22, 2014
SANKEN ELECTRIC CO.,LTD.
7

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부품번호상세설명 및 기능제조사
SKI04044

N-channel Trench Power MOSFET

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