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기능 Distributed Amplifier
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XD1002-BD 데이터시트, 핀배열, 회로
0.05-50.0 GHz GaAs MMIC
Distributed Amplifier
January 2010 - Rev 18-Jan-10
Features
Wide Band Driver Amplifier
9.0 dB Small Signal Gain
5.0 dB Noise Figure
15.0 dB Gain Control
+9.0 dBm P1dB Compression Point
100% On-Wafer RF, DC and Output Power Testing
100% Visual Inspection to MIL-STD-883
Method 2010
D1002-BD
Chip Device Layout
General Description
Mimix Broadband’s 0.05-50.0 GHz GaAs MMIC
distributed amplifier has a small signal gain of 9.0 dB
with a noise figure of 5.0 dB across the band.The
device also includes 15.0 dB gain control and a +9.0
dBm P1dB compression point.This MMIC uses Mimix
Broadband’s GaAs PHEMT device model technology,
and is based upon electron beam lithography to ensure
high repeatability and uniformity.The chip has surface
passivation to protect and provide a rugged part with
backside via holes and gold metallization to allow
either a conductive epoxy or eutectic solder die attach
process.This device is well suited for microwave,
millimeter-wave and wideband military applications.
Absolute Maximum Ratings
Supply Voltage (Vd)
+10.0 VDC
Supply Current (Id)
150 mA
Gate Bias Voltage (Vg1)
+0.3 VDC
Gate Bias Voltage (Vg2)
+3.0 VDC
Input Power (Pin)
+18 dBm
Storage Temperature (Tstg) -65 to +165 ºC
Operating Temperature (Ta) -55 to +85 ºC
Channel Temperature (Tch)1 +175 ºC
(1) Channel temperature affects a device's MTTF. It is
recommended to keep channel temperature as low as
possible for maximum life.
Electrical Characteristics (Ambient Temperature T = 25 oC)
Parameter
Frequency Range (f )
Input Return Loss (S11)
Output Return Loss (S22)
Small Signal Gain (S21)
Gain Flatness ( S21)
Gain Control
Reverse Isolation (S12)
Noise Figure (NF)
Output Power for 1 dB Compression (P1dB)1
Drain Bias Voltage (Vd)
Gain Control Bias (Vg1)
Gate Bias Voltage (Vg2)
Supply Current (Id) (Vd=8.5V, Vg1=0.0V, Vg2=1.0V Typical)
Units
GHz
dB
dB
dB
dB
dB
dB
dB
dBm
VDC
VDC
VDC
mA
Min.
0.05
-
-
-
-
-
-
-
-
-
-2.0
-
-
Typ.
-
14.0
14.0
9.0
+/-1.5
15.0
40.0
5.0
+9.0
+8.5
0.0
+1.0
120
Max.
50.0
-
-
-
-
-
-
-
-
+9.0
+0.1
-
140
(1) Measured using constant current.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 7
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.




XD1002-BD pdf, 반도체, 판매, 대치품
0.05-50.0 GHz GaAs MMIC
Distributed Amplifier
January 2010 - Rev 18-Jan-10
Mechanical Drawing
1.300
(0.051)
0.295
(0.012)
2
0.695
(0.027)
3
D1002-BD
4
1.005
(0.040)
0.295
(0.012)
0.0
1
5
0.0
1.360
(0.054)
1.950
(0.077)
(Note: Engineering designator is 25LN6DA0522)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.417 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg2)
Bond Pad #3 (Vd)
Bond Pad #4 (RF Out)
Bond Pad #5 (Vg1)
Bias Arrangement
Vg2
Bypass Capacitors - See App Note [2]
Vg2 Vd
Vd
23
4 RF Out
RF In 1
5
RF Out
XD1002-BD
RF In
Vg1
Vg1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 7
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.

4페이지










XD1002-BD 전자부품, 판매, 대치품
0.05-50.0 GHz GaAs MMIC
Distributed Amplifier
January 2010 - Rev 18-Jan-10
D1002-BD
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the
environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product.This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or
systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life
support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain
life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic
containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need
careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to
enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible.The mounting surface should
be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured
in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the
die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy
Specifications for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately
0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and
provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. he gold-tin
eutectic (80% Au 20% Sn) has a melting point of approximately 280 ºC (Note: Gold Germanium should be avoided).The work station
temperature should be 310 ºC +/- 10 ºC. Exposure to these extreme temperatures should be kept to minimum.The collet should be
heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during
placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond
pads.The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2%
elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias
connections. Aluminum wire should be avoided.Thermo-compression bonding is recommended though thermosonic bonding may
be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds
should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible.
Part Number for Ordering
XD1002-BD-000V
XD1002-BD-EV1
Description
RoHS compliant die packed in vacuum release gel packs
XD1002-BD evaluation module
Caution: ESD Sensitive
Appropriate precautions in handling, packaging
and testing devices must be observed.
Proper ESD procedures should be followed when handling this device.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 7 of 7
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.

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부품번호상세설명 및 기능제조사
XD1002-BD

Distributed Amplifier

Mimix Broadband
Mimix Broadband

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