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PDF TS33001 Data sheet ( Hoja de datos )
| Número de pieza | TS33001 | |
| Descripción | High Efficiency Synchronous 1/2/3A DC/DC Buck Converter | |
| Fabricantes | Semtech | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TS33001 (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
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TRIUNE PRODUCTS
Features
• Fixed Output option has automatic low power PFM mode
for reduced quiescent current at light loads
• 5MHz +/- 10% fixed switching frequency
• Fixed output voltages: 0.8V, 0.9V, 1.2V, 1.5V, 1.8V,
• 2.5V, and 3.3V with +/- 2% output tolerance
• Input voltage range: 2.5V to 5.5V
• Voltage mode PWM control with input voltage feed-
• Forward compensation
• Voltage supervisor for VOUT reported at the PG pin
• Input supply under voltage lockout
• Soft start for controlled startup with no overshoot
• Full protection for over-current, over-temperature,
• and VOUT overvoltage
• Less than 200nA in shutdown mode
• Multiple enable pins for flexible system sequencing
• Low external component count
• Junction operating temperature -40C to 125C
• Packaged in a 16 pin QFN (3x3)
Applications
• Point of load
• Systems with deep submicron ASICs/FPGAs
• Set-top box
• Communications equipment
• Portable and handheld equipment
TS33001/2/3
High Efficiency Synchronous 1/2/3A
DC/DC Buck Converter, 5Mhz
Description
The TS33001/2/3 (1/2/3A) are DC/DC synchronous switching
regulators with fully integrated power switches, internal
compensation, and full fault protection. The switching
frequency of 5MHz enables the use of extremely small filter
components, resulting in smaller board space and reduced
BOM costs.
When the input current is greater than approximately 50mA,
the TS33001/2/3 utilizes PWM voltage mode feedback with input
voltage feed-forward to provide a wide input voltage range
without the need for external compensation.
When the input current is less than 50mA, the device uses a
PFM mode to provide increased efficiency at light loads. The
cross over between PFM mode and PWM is automatic and
has hysteresis to prevent oscillation between the modes.
Additionally, the nLP mode pin can be used to force the device
into PWM mode to reduce the output ripple, if needed.
The TS33001/2/3 integrates a wide range of protection circuitry;
including input supply under-voltage lockout, output under-
voltage, output over-voltage, soft start, high side FET and low side
FET current limits, and thermal shutdown.
Typical Applications
VCC
nLP
EN
Fixed Output
VCC
22uF
VSW
VOUT
Sense
FB
1µH
nLP
EN
PG
VOUT
10uF
VCC or VOUT
10 kohm
(optional)
PG
TS33001/2/3
Final Datasheet Rev 1.6
January 15, 2016
www.semtech.com
1 of 16
Semtech
Proprietary & Confidential
1 page  
Characteristics
Electrical characteristics, TJ = -40C to 125C, VCC = 5V (unless otherwise noted)
Symbol
Parameter
Condition
Min
VCC Supply Voltage
VCC Input Supply Voltage
I
CC-NORM
I
CC-LPM
I
CC-SHUTDOWN
Quiescent current
Normal Mode
Quiescent current Low Power
PFM Mode
Quiescent current
Shutdown Mod
VCC Under Voltage Lockout
VCC
-UV
VCC-UV_HYST
Input Supply Under Voltage
Threshold
Input Supply Under Voltage
Threshold Hysteresis
OSC
FOSC
PG Open Drain Output
Oscillator Frequency
2.375
VCC = 5V, I = 0A, EN=5V, nLP=5V
LOAD
VCC = 5V, I = 0A, EN=5V, nLP=0V
LOAD
VCC = 5V, EN=0V
VCC Increasing
4.5
T PG Release Timer
PG
I
OH-PG
High-Level Output Leakage
V
OL-PG
Low-Level Output Voltage
EN/nLP Input Voltage Thresholds
V =5V VCC=5V
PG
I = -0.3mA
PG
V
IH-EN/nLP
V
IL-EN/nLP
VHYST-EN/nLP
I
IN-EN
nLP
PD
Thermal Shutdown
TSD
TSD
HYST
High Level Input Voltage
Low Level Input Voltage
Input Hysteresis
EN Input Leakage
nLP Pulldown Resistor
Thermal Shutdown Junction
Temperature
TSD Hysteresis
VCC=2V to 5V
VCC=2V to 5V
VCC=2V to 5V
VEN=5V VCC=5V
V =0V VCC=5V
EN
Pulldown to GND
2.2
150
Typ
18
150
2.2
200
5
10
0.1
400
0.2
0.2
65
170
10
Max
5.5
0.2
5.5
0.01
0.4
190
Unit
V
mA
µA
µA
V
mV
MHz
ms
µA
V
V
V
mV
µA
µA
KΩ
C
C
TS33001/2/3
Final Datasheet Rev 1.6
January 15, 2016
www.semtech.com
5 of 16
Semtech
Proprietary & Confidential
5 Page 
Mold compound
Die
Epoxy Die attach
Exposed pad
Solder
5% - 10% Cu coverage
Single Layer, 2oz Cu
Ground Layer, 1oz Cu
Thermal Vias with Cu plating
90% Cu coverage
Signal Layer, 1oz Cu
20% Cu coverage
Bottom Layer, 2oz Cu
Note: NOT to Scale
The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each
application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the
power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above
85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in
the application.
Application Using A Single Layer PCB
Use as much Copper Area
as possible for heat spread
Package Thermal Pad
Package Outline
Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board
application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method
(solder paste or thermal conductive epoxy).
In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat.
IMPORTANT:
If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation
capability will be adversely affected if the device is incorrectly mounted onto the circuit board.
TS33001/2/3
Final Datasheet Rev 1.6
January 15, 2016
www.semtech.com
11 of 16
Semtech
Proprietary & Confidential
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet TS33001.PDF ] | |
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