W83627HG - LPC I/O

Winbond에서 제조한 전자 부품 W83627HG은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.

W83627HG의 기능 및 특징 중 하나는 "LPC I/O" 입니다.

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W83627HG 기능

LPC I/O

Winbond

W83627HG 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.

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W83627HF/F W83627HG/G Winbond LPC I/O Date： 2006/06/09 Revision： 2.27 W83627HF/ F/ HG/ G W83627HF/F, W83627HG/G Data Sheet Revision History VERSION DATE PAGE DESCRIPTION 0.50 09/25/98 n.a. 88-93,102,105, 139,151,153 90-93;113-115 90,91,113-115, 119-123,133,136, 137,140,141 All All 90 1. P74 ~ P76 2. P3,P90,P111 3. P6~P7 Not released For internal use only First published. Explanation of H/W Monitor function andregister correction. Pinout and register correction. Typo and data correction. H/W Monitor register explanation. New composition. New composition. Correct SUSLED mode register 1. Add Section 4.1 Plug and Pla Configu

Contents of page 4 out of 30 pages :

W83627HF/ F/ HG/ G 7.7 REGISTERS AND RAM............................................................................................... 42 8. SERIAL IRQ .............................................................................................................................. 76 8.1 Start Frame .................................................................................................................. 76 8.2 IRQ/Data Frame........................................................................................................... 76 8.3 Stop Frame .................................................................................................................. 77 9. CONFIGURATION REGISTER ................................................................................................ 78 9.1 Plug and Play Configuration ........................................................................................ 78 9.1.1 Compatible PnP..............................................................................................................78 9.1.2 Configuration Sequence .................................................................................................79 9.2 Chip（Global）Control Register .................................................................................. 81 9.3 Logical Device 0 （FDC） ........................................................................................... 87 9.4 Logical Device 1 （Parallel Port）............................................................................... 91 9.5 Logical Device 2 （UART A） ..................................................................................... 93 9.6 Logical Device 3 （UART B） ..................................................................................... 94 9.7 Logical Device 5 （KBC） ........................................................................................... 96 9.8 Logical Device 6 （CIR） ............................................................................................ 97 9.9 Logical Device 7 （Game Port, MIDI Port and GPIO Port 1）.................................... 97 9.10 Logical Device 8 （GPIO Port 2 and Watch Dog Timer） ......................................... 98 9.11 Logical Device 9 （GPIO Port 3, VSB powered）..................................................... 100 9.12 Logical Device A （ACPI）........................................................................................ 101 9.13 Logical Device B （Hardware Monitor） ................................................................... 108 10. SPECIFICATIONS .................................................................................................................. 110 10.1 Absolute Maximum Ratings ....................................................................................... 110 10.2 DC CHARACTERISTICS........................................................................................... 110 11. APPLICATION CIRCUITS ...................................................................................................... 118 11.1 Parallel Port Extension FDD ...................................................................................... 118 11.2 Parallel Port Extension 2FDD .................................................................................... 118 11.3 Four FDD Mode ......................................................................................................... 119 12. ORDERING INSTRUCTION ................................................................................................... 120 13. HOW TO READ THE TOP MARKING.................................................................................... 120 14. PACKAGE DIMENSIONS ....................................................................................................... 121 15. APPENDIX A ： DEMO CIRCUIT .......................................................................................... 122 - iii - Publication Release Date: June 09, 2006 Revision 2.27

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W83627HG 데이터시트 PDF

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관련 데이터시트

부품번호	상세설명 및 기능	제조사
W83627HF	WINBOND I/O	Winbond
W83627HF	Winbond LPC I/O	Winbond