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Datasheet SOP8501 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | Category |
| 1 | SOP8501 | High Voltage Driver Applications Ordering number : ENN8007
SOP8501
SOP8501
Features
• •
PNP Epitaxial Planar Silicon Transistor NPN Triple Diffused Planar Silicon Transistor
High-Voltage Driver Applications
High breakdown voltage. (VCEO≥400V) Excellent hFE linearlity.
Specifications
Absolute Maximum Ratings at Ta=25°C
|  Sanyo | driver |
| 2 | SOP8501 | Transistor SOP8501
Ordering number : ENN8007
SOP8501
PNP Epitaxial Planar Silicon Transistor NPN Triple Diffused Planar Silicon Transistor
High-Voltage Driver Applications
Features
• High breakdown voltage. (VCEO≥400V) • Excellent hFE linearlity.
Specifications
Absolute Maximum Ratings at Ta=25°C
|  ON Semiconductor | transistor |
SOP Datasheet ( Hoja de datos ) - resultados coincidentes |
| N.º | Número de pieza | Descripción | Fabricantes | Catagory |
| 1 | SOP-112HST | (SOP Series) Element Key Switches MITSUMI
Element Key Switches
SOP Series
Switches
FEATURES
1. Extra low-profile 0.6mm thickness. 2. Surface mounting type and permits re-flow soldering. Taping type for auto mounting is available. 3. Click feel with metal diaphragm contact.
USES
1. For VCR camcorder, thin and compact sets. 2. Fo  Mitsumishi data | | |
| 2 | SOP-114HST | (SOP Series) Element Key Switches MITSUMI
Element Key Switches
SOP Series
Switches
FEATURES
1. Extra low-profile 0.6mm thickness. 2. Surface mounting type and permits re-flow soldering. Taping type for auto mounting is available. 3. Click feel with metal diaphragm contact.
USES
1. For VCR camcorder, thin and compact sets. 2. Fo Mitsumishi data | | |
| 3 | SOP-28 | SOP-28 SOP-28
m o .c U 4 t e e h S a t a .D w w w
Änderungen und Irrtümer vorbehalten
RUTRONIK Elektronische Bauelemente GmbH Industriestraße. 2 · 75228 Ispringen · Telefon. (0 72 31) 801-0 · Fax (0 72 31) 8 22
m o .c U 4 t e e h S a at .D w w w
 Rutronik data | | |
| 4 | SOP-28PIN | SOP-28 PIN SOP28PIN
SYMBOLS A A1 D E H L ș°
w
w
w
t a .D
MIN 0.093 0.004 0.697 0.291 0.394 0.016 0°
S a
e h
MAX 0.104 0.012 0.713 0.299 0.419 0.050 8°
U 4 t e
MIN 2.362 0.102 17.704 7.391 10.008 0.406 0°
.c
m o
NOR
NOR (mm) 2.502 0.203 17.907 7.493 10.325 0.838 4°
MAX 2.642 0.305 18.110 7.59  ETC data | | |
| 5 | SOP-8 | Packaging Outline Tech MOS Technology
SOP-8 Packaging Outline
E
H
e1
e2
D A1
A
C L
0.004max.
SYMBOLS A A1 C D E H e1 e2 L
Millimeters MIN. 1.35 0.10 0.18 4.80 3.80 5.80 0.35 0.40 Nom. 1.55 0.17 0.22 4.90 3.90 6.00 0.43 1.27BSC 0.65 MAX. 1.75 0.25 0.25 5.00 4.00 6.20 0.56 1.27 MIN. 0.05 ETC data | | |
| 6 | SOP-J14 | LSI Assembly
LSI Assembly
SOP-J14
• SOP-J14
8.65 ± 0.1 (Max 9.0 include BURR)
14 8
4¼ +6¼ -4¼
6.0 ± 0.2 3.9 ± 0.1
0.515
1
1PIN MARK
7
1.375 ± 0.075
S
1.65MAX
0.175 ± 0.075
1.27
0.42
+0.05 -0.04
0.08
0.08 S
M
The contents described herein are subject to change with  ROHM Semiconductor data | | |
| 7 | SOP-J8 | LSI Assembly LSI Assembly
SOP-J8
(Units : mm)
• SOP-J8
4.9
8765
1 2 34
w
w
w
t a .D
H=1.75Max.
S a
e h
U 4 t e
.c
6.0 3.9
m o
The contents described herein are subject to change without notice.
w
w
w
.D
a
S a t
e e h
U 4 t
m o .c
Appendix
Notes
No technical content pages of this docu ROHM Semiconductor data | |
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